EP1K30FC256-3NAA vs EP1K30FI256-2N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP1K30FC256-3NAA sa pamamagitan ng Intel at EP1K30FI256-2N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP1K30FC256-3NAA | EP1K30FI256-2N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Obsolete | Obsolete |
| Product Category | FPGA - Field Programmable Gate Array | — |
| Family | ACEX-1K | ACEX-1K |
| Number of Logic Elements | 1728 | — |
| Number of Gates | 30000 (30K) | — |
| Embedded RAM Bits | 24576 bits | 24,576 |
| Number of User I/Os | 171 | — |
| Maximum Internal Clock Frequency | 200 MHz | — |
| Core Supply Voltage | 2.5 V | 2.5 V |
| IC Process Technology | 0.22 um | — |
| Package Type | 256-ball FBGA (FineLine BGA) | — |
| Package Form | 256-BBGA | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Speed Grade | -3 (ordering code) | -2 |
| Configuration Type | SRAM-based, external configuration device required | — |
| Hanay ng Temperature na Operasyon | [DATA_NEEDED: operating temperature range] | — |
| I/O Supply Voltage | [DATA_NEEDED: VCCIO voltage options] | — |
| Power Dissipation | [DATA_NEEDED: typical power dissipation, design dependent] | — |
| Lead-Free / RoHS | [DATA_NEEDED: manufacturer PCN confirms RoHS status] | — |
| Typical Gates | — | 30,000 |
| Logic Elements (LEs) | — | 1,728 |
| Maximum User I/O | — | 171 |
| Process Technology | — | 0.22 µm CMOS |
| Maximum Internal Frequency | — | 200 MHz |
| Number of LABs | — | 216 |
| Packhaging | — | 256-ball FineLine BGA (FBGA) |
| Operating Temperature Grade | — | Industrial |
| Programmable via | — | JTAG (IEEE 1149.1) |
| Uri ng Memory | — | Dual-port Embedded Array Block (EAB) |