EP1K30TI144-2N vs EP1K30TI144-2 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP1K30TI144-2N sa pamamagitan ng Intel at EP1K30TI144-2 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP1K30TI144-2N | EP1K30TI144-2 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Obsolete | Obsolete |
| Series | ACEX-1K | EP1K30 |
| Manufacturer | Intel (formerly Altera) | — |
| Logic Elements / Cells | 1728 | 1728 |
| Typical Gate Count | 30,000 gates | — |
| Embedded Memory (RAM bits) | 24,576 bits | — |
| Maximum User I/O | 102 | — |
| Number of Logic Array Blocks (LABs) | [DATA_NEEDED: LAB count] | 216 |
| Number of Embedded Array Blocks (EABs) | [DATA_NEEDED: EAB count] | — |
| Core Voltage (VCCINT) | 2.5 V | — |
| I/O Voltage (VCCIO) | 2.5 V / 3.3 V | — |
| Process Technology | 0.22 µm CMOS SRAM | 0.22 µm CMOS, SRAM-based |
| Speed Grade | -2 | -2 (mid-tier) |
| Operating Temperature Grade | Industrial | — |
| Hanay ng Temperature na Operasyon | -40 °C to +100 °C ambient | — |
| Packhaging | 144-pin LQFP | 144-LQFP (TQFP), 22 mm × 22 mm, 0.5 mm pitch |
| Lead Pitch | 0.5 mm | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Configuration Interface | JTAG (IEEE 1149.1), serial passive/active | — |
| Tindminan RoHS | Compliant (per Utmel product note) | [DATA_NEEDED: RoHS compliance - legacy part] |
| Level ng MSL | [DATA_NEEDED: MSL rating] | — |
| Family | — | ACEX-1K |
| Total RAM Bits | — | 24576 |
| Equivalent Gates | — | 30,000 |
| User I/O Count | — | 102 |
| Number of I/O Banks | — | 4 |
| Supply Voltage - Core | — | 2.5 V (2.375 V min, 2.625 V max) |
| Supply Voltage - I/O | — | 2.5 V / 3.3 V / 5.0 V (multiVolt) |
| Maximum Internal Frequency | — | 200 MHz |
| Embedded Memory Type | — | Dual-port EAB (Embedded Array Block) |
| Temperature na Operasyon | — | -40 °C to +85 °C (Industrial, "I" suffix) |
| Configuration Method | — | SRAM, requires external configuration PROM (EPC) |
| Programming Interface | — | JTAG (IEEE 1149.1) / IEEE 1532 ISP |