EP1K50FC256-2N vs EP1K100FI256-2N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP1K50FC256-2N sa pamamagitan ng Intel at EP1K100FI256-2N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP1K50FC256-2N | EP1K100FI256-2N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Obsolete | Obsolete |
| Family | ACEX-1K | ACEX 1K |
| Logic Elements (LEs) | 2,880 | — |
| Typical Gates | 50,000 | — |
| Embedded Memory (bits) | 40,960 | — |
| Embedded Array Blocks (EABs) | 10 | 6 |
| Logic Array Blocks (LABs) | 360 | 624 |
| Maximum User I/O Pins | 186 | — |
| Core Voltage (VCCINT) | 2.5 V (2.375 V to 2.625 V) | — |
| Temperature na Operasyon | 0 °C to 70 °C (Commercial) | -40 °C to +85 °C (Industrial) |
| Process Technology | 0.22 µm CMOS SRAM | 0.22 µm CMOS |
| Speed Grade | -2 | -2 (faster bin) |
| Packhaging | 256-ball FBGA (FineLine BGA) | 256-ball FineLine BGA (FBGA-256) |
| Package Dimensions | 16 x 16 mm | — |
| Configuration Method | JTAG / Passive Serial | — |
| Tindminan RoHS | [DATA_NEEDED: RoHS status] | Non-compliant (leaded 'N' ball finish) |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount |
| Series | — | EP1K100 |
| Logic Elements | — | 4,992 |
| System Gates | — | 100,000 |
| Total RAM Bits | — | 49,152 |
| Maximum User I/O | — | 186 |
| Core Supply Voltage | — | 2.5 V |
| I/O Supply Voltage | — | 2.5 V / 3.3 V / 5.0 V (MultiVolt) |
| Ball Finish | — | Leaded (SnPb) - 'N' suffix |
| Configuration Interface | — | JTAG (IEEE 1149.1) + serial modes |