EP1M350F780C7 vs EP1M350F780C7ES Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP1M350F780C7 sa pamamagitan ng Intel at EP1M350F780C7ES sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP1M350F780C7 | EP1M350F780C7ES |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | NRND | Aktibo |
| Family | Mercury (PLD) | — |
| Device Logic Elements | [DATA_NEEDED: exact LE count] | — |
| Logic Array Blocks (LABs) | 1440 | — |
| System Gates | 350,000 | — |
| Maximum User I/Os | 486 | — |
| Packhaging | 780-ball FineLine BGA (F780) | — |
| Package Type | FINE LINE BGA-780 | FINE LINE BGA-780 |
| Supply Voltage (Core) | 1.8 V | — |
| Logic Family | CMOS | CMOS |
| Temperature na Operasyon | 0 C to 85 C (Commercial) | 0 C to 85 C |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Transceivers / CDR Support | Up to 1.25 Gbps with CDR | — |
| Configuration Method | JTAG / Quartus II | — |
| Tindminan RoHS | [DATA_NEEDED: rohs status] | unknown |
| Level ng MSL | [DATA_NEEDED: MSL rating] | — |
| Process Technology | CMOS SRAM-based | — |
| Product Type | — | Field Programmable Gate Array (FPGA) |
| User I/O Count | — | 486 pins |
| Total Package Pins | — | 780 pins |
| Package Category | — | 780-BBGA |
| Volte ng Pagbibigay | — | 1.8 V |
| Maximum Stated Transceiver Data Rate | — | 1.25 Gbps |
| Channels Supported at 1.25 Gbps | — | 8 channels |
| Remaining Channel Limit | — | 10 channels at 1.0 Gbps or less |
| Clock Data Recovery | — | Supported |
| High-Speed Transceivers | — | Integrated |
| REACH Status | — | unknown |
| Logic Element Count | — | [DATA_NEEDED: logic element count] |
| Embedded Memory Capacity | — | [DATA_NEEDED: embedded memory capacity] |
| Transceiver Count | — | [DATA_NEEDED: transceiver count] |
| Package Dimensions | — | [DATA_NEEDED: package dimensions] |
| Thermal Resistance | — | [DATA_NEEDED: junction-to-ambient thermal resistance] |