EP1M350F780C7 vs EP1M350F780C7ES Karşılaştırma
Ayrıntılı yan yana karşılaştırma EP1M350F780C7 tarafından Intel ve EP1M350F780C7ES tarafından IntelAnahtar özellikleri, elektriksel parametreleri, ambalajı, yaşam döngüsü durumu, fiyatlandırma ve mevcudiyeti karşılaştırarak tasarım gereksinimleriniz için en iyi bileşeni belirleyin.
Özellik Karşılaştırması
| Parametre | EP1M350F780C7 | EP1M350F780C7ES |
|---|---|---|
| Marka | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Yaşam Döngüsü Durumu | NRND | Aktif |
| Family | Mercury (PLD) | — |
| Device Logic Elements | [DATA_NEEDED: exact LE count] | — |
| Logic Array Blocks (LABs) | 1440 | — |
| System Gates | 350,000 | — |
| Maximum User I/Os | 486 | — |
| Paket | 780-ball FineLine BGA (F780) | — |
| Package Type | FINE LINE BGA-780 | FINE LINE BGA-780 |
| Supply Voltage (Core) | 1.8 V | — |
| Logic Family | CMOS | CMOS |
| İşletim Sıcaklığı | 0 C to 85 C (Commercial) | 0 C to 85 C |
| Montaj Türü | Surface Mount | Surface Mount |
| Transceivers / CDR Support | Up to 1.25 Gbps with CDR | — |
| Configuration Method | JTAG / Quartus II | — |
| RoHS Durumu | [DATA_NEEDED: rohs status] | unknown |
| MSL Seviyesi | [DATA_NEEDED: MSL rating] | — |
| Process Technology | CMOS SRAM-based | — |
| Product Type | — | Field Programmable Gate Array (FPGA) |
| User I/O Count | — | 486 pins |
| Total Package Pins | — | 780 pins |
| Package Category | — | 780-BBGA |
| Besleme Gerilimi | — | 1.8 V |
| Maximum Stated Transceiver Data Rate | — | 1.25 Gbps |
| Channels Supported at 1.25 Gbps | — | 8 channels |
| Remaining Channel Limit | — | 10 channels at 1.0 Gbps or less |
| Clock Data Recovery | — | Supported |
| High-Speed Transceivers | — | Integrated |
| REACH Status | — | unknown |
| Logic Element Count | — | [DATA_NEEDED: logic element count] |
| Embedded Memory Capacity | — | [DATA_NEEDED: embedded memory capacity] |
| Transceiver Count | — | [DATA_NEEDED: transceiver count] |
| Package Dimensions | — | [DATA_NEEDED: package dimensions] |
| Termal Direnç | — | [DATA_NEEDED: junction-to-ambient thermal resistance] |