EP1S30F780I6N vs EP1S30F780C8N Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP1S30F780I6N sa pamamagitan ng Intel at EP1S30F780C8N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EP1S30F780I6N EP1S30F780C8N
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Huling Pagbili Huling Pagbili
Family Stratix Stratix
Logic Elements 32,470 —
Total RAM Bits 3,317,184 bits —
User I/O Count 597 —
Package Type 780-BBGA, FCBGA (FineLine BGA) —
Temperature na Operasyon -40C to +100C (Industrial, I6) 0 °C to +85 °C (Commercial)
Process Technology 130 nm 130 nm CMOS
Supply Voltage (Core) [DATA_NEEDED: core voltage] 1.5 V
I/O Standards Supported LVTTL, LVCMOS, LVDS, SSTL, HSTL —
Lead-Free / RoHS Lead-free terminal finish (N suffix), RoHS-compliant —
Speed Grade -6 C8 (-8, faster bin)
DSP Blocks Yes (TriMatrix + DSP blocks per Stratix family) —
Uri ng Pagpapasok Surface Mount Surface Mount
Level ng MSL 3 (per typical FBGA moisture sensitivity) [DATA_NEEDED: MSL level]
JEDEC Code (e1) e1 (Pb-free / matte tin) —
Series — Stratix (EP1S)
Logic Elements (LEs) — 32,470
Embedded Memory (RAM bits) — 3,317,184
Total Memory Bits — 3,317,184
User I/Os — 597
LABs (Logic Array Blocks) — 3,247
Packhaging — 780-ball FC-FBGA (FineLine BGA), 29 × 29 mm, 1 mm pitch
Configuration — SRAM-based, JTAG / Passive Serial / Passive Parallel
Tindminan RoHS — Compliant (per distributor listings)

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