EP1SGX25DF672I7 vs EP1SGX25DF672I7N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP1SGX25DF672I7 sa pamamagitan ng Intel at EP1SGX25DF672I7N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP1SGX25DF672I7 | EP1SGX25DF672I7N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Obsolete | Obsolete |
| Series | Stratix GX | — |
| Family | Stratix GX (EP1SGX25) | Stratix GX |
| Logic Elements | 25,660 | 25,660 |
| Configurable Logic Blocks (CLBs) | 2,566 | — |
| Total RAM Bits | 1,944,576 | — |
| Number of Logic Array Blocks (LABs) | 455 | — |
| Maximum Internal Clock Frequency | 4385.97 MHz | — |
| Combinatorial CLB Delay (max) | 9.48 ns | — |
| Process Technology | CMOS 130 nm | 130 nm CMOS |
| Nominal Supply Voltage | 1.5 V | — |
| Supply Voltage Range | 1.425 V to 1.575 V | 1.425 V to 1.575 V |
| Operating Temperature Grade | MILITARY / Industrial | — |
| Speed Grade | I7 (slowest industrial) | — |
| Package Code | DF (672-ball FC-FBGA) | — |
| Number of Terminals | 672 | 672 |
| Terminal Form | Ball (BGA) | Ball (BGA) |
| Package Shape | Square | — |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount (BGA) |
| Tindminan RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: rohs status] |
| CLBs | — | 2,566 |
| Maximum Operating Frequency | — | 4385.97 MHz (logic); 4.7 MHz (combinatorial CLB delay rating) |
| Combinatorial Delay (CLB) | — | 9.48 ns max |
| High-Speed Transceiver Channels | — | 4 |
| Transceiver Data Rate | — | 500 Mbps to 3.1875 Gbps per channel |
| Core Supply Voltage (VCCINT) | — | 1.5 V |
| Packhaging | — | 672-ball FineLine BGA (FC-FBGA), 33 × 33 mm, 1 mm pitch |
| Logic Family | — | CMOS |
| Temperature na Operasyon | — | 0 °C to 85 °C (industrial) |
| Lead-Free | — | Yes |