EP1SGX25F672C7N vs EP1SGX25CF672C7N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP1SGX25F672C7N sa pamamagitan ng Intel at EP1SGX25CF672C7N sa pamamagitan ng Altera. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP1SGX25F672C7N | EP1SGX25CF672C7N |
|---|---|---|
| Brand | Intel | Altera |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Obsolete | Obsolete |
| Family | Stratix GX | Stratix GX |
| Logic Elements | 25,660 | 25660 |
| Configurable Logic Blocks (CLBs) | 2,566 | — |
| Embedded Memory (bits) | 1,944,576 | — |
| Number of I/O Banks | 4 | — |
| Maximum User I/O | [DATA_NEEDED: max user I/O pins] | — |
| Number of Registers | 25,660 | — |
| Number of Transceivers | Up to 20 | — |
| Transceiver Data Rate | 3.125 Gbps | Up to 3.1875 Gbps |
| Operating Supply Voltage (Core) | 1.5 V nominal | — |
| Hanay ng Temperature na Operasyon | 0°C to 85°C (commercial) | — |
| Process Technology | CMOS | — |
| Packhaging | 672-ball FineLine BGA (FBGA672), 1.00 mm pitch | 672-ball FC-FBGA |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Level ng MSL | 3 | — |
| Tindminan RoHS | Compliant (lead-free FBGA) | — |
| Logic Array Blocks (LABs) | — | 2566 |
| User I/O Pins | — | 455 |
| Embedded Memory Bits | — | 1944576 |
| High-Speed Transceiver Channels | — | Up to 20 |
| Core Voltage | — | 1.5 V |
| Temperature na Operasyon | — | 0 C to 85 C (Commercial) |
| Package Dimensions | — | 33 x 33 mm |
| Ball Pitch | — | 1.0 mm |
| Configuration Method | — | SRAM (volatile, requires external flash) |
| Lead-Free / RoHS | — | RoHS3 Compliant |
| Logic Family / Process | — | CMOS, 1.5 V core |