EP1SGX40DF1020I6N vs EP1SGX40DF1020C6N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP1SGX40DF1020I6N sa pamamagitan ng Intel at EP1SGX40DF1020C6N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP1SGX40DF1020I6N - Stratix GX FPGA, 41.25K LEs, 1020-FBGA | Intel
EP1SGX40DF1020I6N ✓ NakahandaPagsanggunian na paghahambing
| Parametro | EP1SGX40DF1020I6N | EP1SGX40DF1020C6N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Obsolete |
| Series | Stratix GX | — |
| Family | Stratix (First Generation) | Stratix GX |
| Manufacturer | Intel (formerly Altera) | — |
| Core Supply Voltage | 1.425 V to 1.575 V (1.5 V nominal) | 1.5 V |
| Number of Logic Elements (LEs) | 41,250 | — |
| Number of LABs (Logic Array Blocks) | 4,125 | — |
| Total RAM Bits | 3,423,744 | 3,423,744 |
| Maximum User I/O Pins | 624 | — |
| Number of I/O Banks | [DATA_NEEDED: I/O bank count] | — |
| High-Speed Transceivers | Integrated GX SerDes (channels, data rate: [DATA_NEEDED: per Stratix GX handbook]) | — |
| Embedded DSP Blocks | Yes (DSP block count: [DATA_NEEDED: per device datasheet]) | — |
| Packhaging / Kaso | 1020-BBGA / 1020-FBGA | — |
| Package Size | 33 x 33 mm, 1.0 mm pitch | — |
| Supplier Device Package | 1020-FBGA (33 x 33) | — |
| Temperature na Operasyon | 0 C to 85 C (industrial grade 'I') | 0 C to 85 C |
| Speed Grade | 6 (I6) | C6 |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount |
| Level ng MSL | [DATA_NEEDED: MSL rating] | [DATA_NEEDED: MSL level] |
| Tindminan RoHS | [DATA_NEEDED: confirm RoHS on datasheet] | [DATA_NEEDED: RoHS status] |
| Logic Family | CMOS (SRAM-based configuration) | CMOS |
| Packaging | Tray / Bulk | — |
| Configuration Mode | Passive Serial / Fast Passive Parallel / JTAG (per Stratix GX handbook) | — |
| Logic Elements | — | 41,250 |
| Number of LABs/CLBs | — | 4125 LABs / 4697 CLBs |
| Number of I/O | — | 624 |
| Process Technology | — | 130 nm CMOS |
| Maximum Internal Frequency | — | 5000 MHz |
| Package Type | — | 1020-FBGA (33 x 33 mm, 1 mm pitch) |