EP20K100CF324C7ES vs EP20K100CF324C7 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP20K100CF324C7ES sa pamamagitan ng Intel at EP20K100CF324C7 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP20K100CF324C7ES | EP20K100CF324C7 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Obsolete | Obsolete |
| Family | APEX-20K | FLEX 10K |
| Logic Elements / Cells | 4160 | — |
| Total System Gates | 263000 | — |
| Number of I/O | 246 | — |
| Number of LABs/CLBs | [DATA_NEEDED: LAB count] | — |
| Number of Logic Elements/Cells | 4160 | — |
| Total RAM Bits | 53248 | — |
| Number of Embedded System Blocks (ESBs) | 16 | — |
| Number of PLLs | 4 | — |
| Voltage - Supply | 2.375 V to 2.625 V | — |
| Temperature na Operasyon | 0C to +85C | 0 °C to +70 °C (commercial) |
| Speed Grade | C7 | C7 (slowest commercial bin) |
| Uri ng Pagpapasok | Surface Mount | Surface Mount (BGA) |
| Packhaging / Kaso | 324-FBGA (19x19 mm) | — |
| Supplier Device Package | 324-FBGA (19x19) | — |
| Process Technology | 0.22 micrometer CMOS | 0.22 µm CMOS SRAM |
| Tindminan RoHS | unknown | unknown |
| Series | — | EP20K100 |
| Logic Elements (LEs) | — | 4,160 |
| System Gates | — | 100,000 |
| Embedded Array Blocks (EABs) | — | 12 |
| Maximum RAM Bits | — | 49,152 |
| Maximum User I/O | — | 246 |
| Packhaging | — | 324-FBGA (FineLine BGA) |
| Supply Voltage - Core | — | 1.8 V |
| Supply Voltage - I/O | — | 1.5 V / 1.8 V / 2.5 V / 3.3 V |
| Configuration Method | — | Serial PROM (EPC2/EPC4/EPC8) or JTAG |