EP20K100EFC324-2X vs EP20K100EFC324-1N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP20K100EFC324-2X sa pamamagitan ng Intel at EP20K100EFC324-1N sa pamamagitan ng Altera. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP20K100EFC324-2X | EP20K100EFC324-1N |
|---|---|---|
| Brand | Intel | Altera |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | NRND | Obsolete |
| Family | APEX 20KE | APEX-20KE |
| Device Type | SPLD / FPGA (Field Programmable Gate Array) | FPGA (Field Programmable Gate Array) |
| System Gates | 100,000 gates | — |
| Logic Elements / Cells | 4,160 | — |
| Total RAM Bits | 53,248 bits | — |
| LABs / CLBs | 416 | — |
| Maximum User I/Os | 246 | — |
| Number of I/O Banks | 8 (per APEX 20KE family) | — |
| Propagation Delay | 1.6 ns | 1.6 ns |
| Internal Operating Frequency | Up to 250 MHz | 250 MHz |
| Core Supply Voltage (VCCINT) | 1.8 V | — |
| I/O Supply Voltage (VCCIO) | MultiVolt: 1.8 V / 2.5 V / 3.3 V | — |
| Process Technology | 0.22 µm CMOS (all-layer copper metal) | 0.15 µm all-layer copper CMOS |
| Speed Grade | -2X | — |
| Packhaging | 324-ball FBGA (FineLine BGA), 19x19 mm, 1.27 mm pitch | 324-BGA (FineLine BGA) |
| Uri ng Pagpapasok | Surface Mount | — |
| Temperature na Operasyon | 0 °C to 85 °C (Commercial) | 0 C to 85 C |
| Programming Interface | IEEE 1149.1 JTAG | — |
| Configuration Modes | Passive Serial, Passive Parallel, JTAG, Altera configuration EPROM | — |
| Tindminan RoHS | [DATA_NEEDED: confirm against lot-specific documentation] | — |
| Logic Elements (LEs) | — | 4160 |
| Typical Gates | — | 100,000 |
| Maximum User I/O | — | 246 |
| Embedded System Blocks (ESBs) | — | 53248 bits |
| Core Voltage | — | 1.8 V |
| I/O Standard Support | — | LVDS, SSTL, HSTL, LVTTL, LVCMOS |
| JTAG Support | — | IEEE 1149.1 boundary-scan |
| Programming Technology | — | SRAM-based (volatile, requires configuration device) |
| MultiVolt I/O | — | 1.8 V core with 3.3 V / 5.0 V I/O support |