EP20K100FC324-1V vs EP20K100FC324-3 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP20K100FC324-1V sa pamamagitan ng Intel at EP20K100FC324-3 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP20K100FC324-1V | EP20K100FC324-3 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Obsolete | Obsolete |
| Series | APEX-20K® | APEX 20K |
| Number of Logic Elements / Cells | 4160 | — |
| Total RAM Bits | 53248 | — |
| Number of Gates (typical) | 100000 | — |
| Number of I/O | 252 | — |
| Number of LABs/CLBs | [DATA_NEEDED: number of Logic Array Blocks] | — |
| Number of EABs | [DATA_NEEDED: number of Embedded Array Blocks] | — |
| Supply Voltage - Core (VCCINT) | 2.375 V to 2.625 V | — |
| Supply Voltage - I/O (VCCIO) | 3.0 V / 3.3 V / 5.0 V tolerant (per I/O standard) | — |
| Speed Grade | -1V (commercial) | -3 (slowest) |
| Temperature na Operasyon | 0C to +85C (commercial) | 0 °C to 85 °C (Commercial) |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Packhaging / Kaso | 324-FBGA (FineLine BGA, 19x19 mm) | — |
| Supplier Device Package | 324-FBGA | — |
| Number of PLLs | 4 | — |
| I/O Standards Supported | LVCMOS, LVTTL, PCI, SSTL, GTL+, HSTL | — |
| Architecture | MultiCore (LUT + product-term + embedded memory) | — |
| Programming Interface | JTAG (IEEE 1149.1) / in-system | IEEE 1149.1 JTAG |
| Tindminan RoHS | [DATA_NEEDED: RoHS compliance] | [DATA_NEEDED: RoHS status] |
| Family | — | APEX 20K (non-KE) |
| System Gates | — | 100,000 |
| Logic Elements | — | 4,160 |
| Maximum Logic Blocks | — | 26 |
| Embedded Memory (RAM bits) | — | 53,248 |
| User I/O Pins | — | 252 |
| Total RAM bits | — | 53,248 |
| Process Technology | — | 0.22 µm CMOS |
| Core Supply Voltage | — | 2.5 V |
| Maximum Internal Frequency | — | 167 MHz |
| Propagation Delay | — | 1.6 ns |
| Packhaging | — | 324-pin FBGA (Fine-pitch BGA) |
| Package Body Size | — | 45 x 45 mm |
| Ball Pitch | — | 1.27 mm |
| Lead-Free | — | [DATA_NEEDED: lead-free status] |