EP20K400CF672C8AA vs EP20K400CF672C8N Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP20K400CF672C8AA sa pamamagitan ng Intel at EP20K400CF672C8N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EP20K400CF672C8AA EP20K400CF672C8N
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Obsolete Obsolete
Family APEX 20K APEX 20KC
Number of Logic Elements/Cells 16640 —
Number of Logic Units (LEs) [DATA_NEEDED: number of LUs] —
Embedded System Blocks (ESBs) 212 —
On-chip RAM Bits [DATA_NEEDED: total embedded memory bits] —
Number of User I/O Pins 488 —
Package Type 672-ball Fine-Pitch BGA (FBGA) —
Number of Pins/Balls 672 —
Supply Voltage (Core) 2.5 V 1.8 V
I/O Standards Supported LVTTL, LVCMOS, PCI, SSTL, HSTL (multi-voltage I/O) —
Propagation Delay [DATA_NEEDED: typical propagation delay] 2.5 ns (C speed grade)
Temperature na Operasyon 0 C to 85 C (Commercial) 0 °C to +85 °C (commercial)
Uri ng Pagpapasok Surface Mount Surface Mount (BGA)
Packaging Tray —
Level ng Sensitivity sa Asid ng Moisture (MSL) 3 (168 Hours) —
Configuration Interface JTAG (IEEE 1149.1), passive serial, passive parallel asynchronous —
Tindminan RoHS [DATA_NEEDED: RoHS status] —
Device Logic Elements — 16,640 (Macros / Cells)
Maximum System Gates — 400,000
Maximum User I/O — 488
Embedded Memory — 212,992 bits
Packhaging — 672-ball FineLine BGA (FC-FBGA672)
Package Body Size — 27 × 27 mm
Ball Pitch — 1.0 mm
Logic Family — CMOS
Process Technology — 0.15 µm all-layer copper CMOS
Maximum Internal Frequency — 301.21 MHz
Lead-Free / RoHS — Yes (N suffix)

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