EP20K400CFC672-9 vs EP20K400FC784-2 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP20K400CFC672-9 sa pamamagitan ng Altera at EP20K400FC784-2 sa pamamagitan ng Altera. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP20K400CFC672-9 | EP20K400FC784-2 |
|---|---|---|
| Brand | Altera | Altera |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | NRND | Obsolete |
| Family | APEX-20KC | APEX 20K |
| Logic Elements / Macrocells | 1664 | — |
| Typical Gate Count | 400,000 gates | — |
| Embedded Memory (ESB) | 212,992 bits | — |
| User I/O Count | 488 | — |
| PLLs | 4 | — |
| Core Supply Voltage | 1.71 V to 1.89 V | — |
| I/O Supply Voltage | 1.5 V / 1.8 V / 2.5 V / 3.3 V | — |
| Operating Temperature (TJ) | 0 °C to 85 °C | — |
| Speed Grade | -9 (commercial, slowest bin) | -2 (industrial) |
| Packhaging | 672-ball FineLine BGA (FCBGA) | 784-Ball FineLine BGA (FC) |
| Package Body Size | 27 mm × 27 mm | — |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount (BGA) |
| Configuration Method | EPC serial device or JTAG | — |
| Process Node | [DATA_NEEDED: process node] | — |
| Tindminan RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: not confirmed in provided data] |
| Device Family Member | — | EP20K400C |
| Typical System Gates | — | 400,000 |
| Maximum User I/O Pins | — | 488 (784-BGA) |
| Logic Elements | — | 16,640 |
| Embedded RAM (ESB) | — | 212 Kbits |
| Maximum Block RAM | — | [DATA_NEEDED: block RAM organization per ESB] |
| Maximum Frequency (internal) | — | [DATA_NEEDED: fmax, datasheet-dependent] |
| Process Technology | — | 0.22 µm CMOS SRAM |
| Core Voltage | — | 2.5 V |
| MultiVolt I/O Voltage | — | 1.8 V / 2.5 V / 3.3 V |
| Supported I/O Standards | — | LVTTL, LVCMOS, PCI, SSTL-2, SSTL-3, GTL+, CTT |
| Configuration Mode | — | Serial / Parallel SRAM-volatile (external PROM required) |
| Temperature na Operasyon | — | [DATA_NEEDED: exact Tj range] |
| Level ng MSL | — | 3 (per Partstack listing) |
| Peak Reflow Temperature | — | 220 °C (per Partstack listing) |
| Hot Socketing | — | Supported |
| JTAG / Boundary-Scan | — | IEEE 1149.1 compliant |