EP20K400FC784-3 vs EP20K400FC784-2 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP20K400FC784-3 sa pamamagitan ng Intel at EP20K400FC784-2 sa pamamagitan ng Altera. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP20K400FC784-3 | EP20K400FC784-2 |
|---|---|---|
| Brand | Intel | Altera |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Obsolete | Obsolete |
| Family | APEX 20K (MultiCore) | APEX 20K |
| Typical Gates | 400,000 | — |
| Maximum System Gates | 1,052,000 | — |
| Logic Elements | 21,168 | 16,640 |
| Maximum RAM Bits | 212,992 | — |
| Embedded System Blocks (ESBs) | 100 | — |
| PLLs | 4 | — |
| User I/O Pins | 488 | — |
| Packhaging | 784-ball FineLine BGA (FC) | 784-Ball FineLine BGA (FC) |
| Speed Grade | -3 | -2 (industrial) |
| Temperature na Operasyon | Commercial (0°C to +85°C) | [DATA_NEEDED: exact Tj range] |
| I/O Standards | MultiVolt I/O: 1.8V, 2.5V, 3.3V, 5.0V | — |
| Core Voltage | [DATA_NEEDED: core voltage] | 2.5 V |
| Process Technology | 0.18 µm CMOS | 0.22 µm CMOS SRAM |
| Configuration Method | Serial or parallel, SRAM-based | — |
| Tindminan RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: not confirmed in provided data] |
| Level ng MSL | [DATA_NEEDED: MSL rating] | 3 (per Partstack listing) |
| Lead-Free | [DATA_NEEDED: lead-free status] | — |
| Device Family Member | — | EP20K400C |
| Typical System Gates | — | 400,000 |
| Maximum User I/O Pins | — | 488 (784-BGA) |
| Embedded RAM (ESB) | — | 212 Kbits |
| Maximum Block RAM | — | [DATA_NEEDED: block RAM organization per ESB] |
| Maximum Frequency (internal) | — | [DATA_NEEDED: fmax, datasheet-dependent] |
| MultiVolt I/O Voltage | — | 1.8 V / 2.5 V / 3.3 V |
| Supported I/O Standards | — | LVTTL, LVCMOS, PCI, SSTL-2, SSTL-3, GTL+, CTT |
| Configuration Mode | — | Serial / Parallel SRAM-volatile (external PROM required) |
| Uri ng Pagpapasok | — | Surface Mount (BGA) |
| Peak Reflow Temperature | — | 220 °C (per Partstack listing) |
| Hot Socketing | — | Supported |
| JTAG / Boundary-Scan | — | IEEE 1149.1 compliant |