EP20K400GC655-3 vs EP20K400GI655-1V Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP20K400GC655-3 sa pamamagitan ng Intel at EP20K400GI655-1V sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP20K400GI655-1V - APEX 20K 400K Gate FPGA, 655-pin CBGA | Intel
EP20K400GI655-1V ⚠ Huling PagbiliPagsanggunian na paghahambing
| Parametro | EP20K400GC655-3 | EP20K400GI655-1V |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Huling Pagbili | Huling Pagbili |
| Series | APEX-20KC | — |
| Family | APEX 20K | APEX 20K |
| Manufacturer | Intel (formerly Altera) | — |
| Logic Elements | 16640 | 16,640 |
| Total RAM Bits | 212992 | — |
| Number of Gates | 400000 | — |
| Supply Voltage - Core | 1.71 V to 1.89 V (1.8 V nominal) | — |
| I/O Voltage Tolerance | MultiVolt I/O: 1.8 V / 2.5 V / 3.3 V / 5 V | — |
| Temperature na Operasyon | -40C to +85C (industrial) | [DATA_NEEDED: industrial vs military grade] |
| Maximum Frequency | 167 MHz (per FPGAkey) | — |
| Process Technology | 0.22 um CMOS | CMOS |
| Packhaging / Kaso | 655-BCPGA | — |
| Supplier Device Package | 655-CPGA (62.48 x 62.48 mm) | — |
| Speed Grade | -3 (slowest grade in family) | — |
| Propagation Delay (tPD) | 3.6 ns (per Microchip USA listing) | — |
| JTAG Support | IEEE 1149.1 Boundary-Scan | — |
| Configuration Modes | Passive Serial, Passive Parallel Sync/Async, Active Serial | — |
| Tindminan RoHS | [DATA_NEEDED: rohs status] | [DATA_NEEDED] |
| Typical Gates | — | 400,000 |
| Maximum User I/O | — | 502 |
| Dedicated Inputs | — | 4 |
| Package Type | — | CBGA-655 (Ceramic Ball Grid Array) |
| Package Code (JESD-30) | — | S-CPGA-P655 |
| Package Equivalence Code | — | SPGA655, 47x47 |
| Propagation Delay | — | 2.5 ns |
| Core Supply Voltage | — | 2.5 V |
| I/O Supply Voltage | — | 2.5 V / 3.3 V |
| Configuration | — | In-system programmable via JTAG |
| Boundary Scan | — | IEEE 1149.1 JTAG |
| Level ng MSL | — | 1 |
| Package Body Material | — | Ceramic |