EP20K400GI655-2X vs EP20K400GI655-1X Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP20K400GI655-2X sa pamamagitan ng Intel at EP20K400GI655-1X sa pamamagitan ng Altera. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Altera
EP20K400GI655-1X - 400K Gate APEX 20K FPGA, 16640 Logic Elements, 655-Pin CPGA | Altera (Intel)
EP20K400GI655-1X ObsoletePagsanggunian na paghahambing
| Parametro | EP20K400GI655-2X | EP20K400GI655-1X |
|---|---|---|
| Brand | Intel | Altera |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Obsolete | Obsolete |
| Series | APEX-20K | — |
| Family | APEX-20K (loadable PLD / FPGA) | APEX 20K |
| Logic Elements (LEs) | 16,640 | — |
| System Gates | 400,000 | — |
| Maximum User I/O | 502 | — |
| Total I/O Lines | 496 (bidirectional) + 4 (dedicated inputs) | — |
| Embedded Memory (bits) | 212,992 | — |
| Nominal Core Supply Voltage | 2.5 V | — |
| Supply Voltage Range | 2.375 V to 2.625 V | — |
| I/O Supply Voltages | 2.5 V / 3.3 V | — |
| Process Technology | CMOS | CMOS, SRAM-based configuration |
| Propagation Delay (typical, -2 grade) | 3.1 ns | — |
| Packhaging | 655-ball FineLine BGA (SPGA655, 47x47 mm) | — |
| Package Code | SPGA655, 47x47 | — |
| Surface Mount | Yes (BGA) | — |
| Level ng Sensitivity sa Asid ng Moisture (MSL) | 1 | 1 |
| Operating Temperature (industrial -X grade) | -40C to +85C (industrial) | — |
| Tindminan RoHS | [DATA_NEEDED: RoHS compliance] | Compliant |
| Qualification | Not Qualified (per distributor listing) | — |
| JTAG Support | IEEE 1149.1 boundary-scan / programming | — |
| Device | — | EP20K400 |
| Logic Elements | — | 16640 |
| Number of Terminals | — | 655 |
| User I/O Lines | — | 502 |
| Dedicated Inputs | — | 4 |
| Package Type | — | Ceramic Pin Grid Array (CPGA) |
| Package Code (JESD-30) | — | S-CPGA-P655 |
| Package Equivalence Code | — | SPGA655,47X47 |
| Package Body Material | — | CERAMIC (metal-sealed co-fired) |
| Speed Grade | — | -1 |
| Propagation Delay | — | 2.5 ns (typical for -1 grade) |
| Peak Reflow Temperature | — | 220 C |
| Temperature na Operasyon | — | -40 C to +85 C (industrial) |
| Uri ng Pagpapasok | — | Through-Hole (PGA) |