EP20K600CF672-2X vs EP20K600CF672 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP20K600CF672-2X sa pamamagitan ng Altera at EP20K600CF672 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP20K600CF672 - 600K APEX 20KC FPGA, 672-BGA | Intel
EP20K600CF672 [data_needed: lifecycle status]Pagsanggunian na paghahambing
| Parametro | EP20K600CF672-2X | EP20K600CF672 |
|---|---|---|
| Brand | Altera | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Obsolete | [DATA NEEDED: Lifecycle Status] |
| Family | APEX 20KC | — |
| Maximum Logic Elements | 24,320 | — |
| Typical Gates | 600,000 | — |
| Maximum User I/O Pins | 508 | — |
| Embedded System Blocks (ESBs) | [DATA_NEEDED: ESB count] | — |
| Maximum Embedded RAM | 311,296 bits | — |
| Speed Grade | -2 | — |
| Packhaging | 672-ball FineLine BGA (CF672) | — |
| Operating Voltage (Core) | [DATA_NEEDED: VCCINT] | — |
| I/O Standards Supported | LVTTL, LVCMOS, PCI, GTL+, SSTL, LVDS | — |
| Configuration Mode | EPC (Enhanced Configuration) devices | — |
| Temperature na Operasyon | [DATA_NEEDED: temperature grade] | 0 C to 85 C for supplied EP20K600CF672C9N/C8N references |
| Process Technology | 0.18 um CMOS | 0.15 um all-layer copper-metal process for supplied family references |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount |
| Level ng MSL | [DATA_NEEDED: MSL level] | — |
| Tindminan RoHS | [DATA_NEEDED: RoHS status] | unknown |
| Product Type | — | Field-Programmable Gate Array (FPGA) |
| Product Family | — | APEX-20KC |
| Manufacturer | — | Altera / Intel |
| User I/O Lines | — | 508 I/O |
| Logic Elements | — | [DATA_NEEDED: logic element count] |
| Propagation Delay | — | 1.48 ns for supplied EP20K600CF672C9N/C8N references |
| Device Type Listed by Supplied References | — | SPLD |
| Performance Claim | — | Up to 35% faster than APEX 20KE devices |
| Package Type | — | 672-ball BGA, FCBGA |
| Package Dimensions | — | 45 mm x 45 mm |
| Ball Pitch | — | 1.27 mm |
| Configuration Device Type | — | Enhanced Configuration (EPC) device |
| Core Voltage | — | [DATA_NEEDED: core supply voltage] |
| I/O Voltage | — | [DATA_NEEDED: I/O supply voltage] |
| Configuration Memory | — | [DATA_NEEDED: configuration memory type and capacity] |
| Embedded Memory | — | [DATA_NEEDED: embedded memory capacity] |
| REACH Status | — | unknown |
| AEC-Q100 Status | — | unknown |