EP2A25F672C8 vs EP2A25F672C9 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2A25F672C8 sa pamamagitan ng Altera at EP2A25F672C9 sa pamamagitan ng Altera. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP2A25F672C8 | EP2A25F672C9 |
|---|---|---|
| Brand | Altera | Altera |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Obsolete | NRND |
| Family | APEX II (EP2A25) | APEX II |
| Logic Elements | 25,000 (typical gates) | — |
| Maximum System Gates | 40,960 | — |
| Macrocells / Embedded Logic | 2,432 macros | — |
| User I/O Count | 492 | — |
| Packhaging | 672-FBGA (FineLine BGA, 27x27 mm, 1.0 mm pitch) | 672-ball FCBGA (FineLine BGA) |
| Propagation Delay (tpd) | 1.69 ns | — |
| Speed Grade | C8 | — |
| Temperature na Operasyon | 0 C to 85 C (commercial) | 0°C to 85°C (Commercial) |
| Process Technology | 0.15 microm CMOS, 8-layer copper interconnect | 0.15 µm all-layer copper, up to 8 metal layers |
| I/O Standards Supported | LVTTL, LVCMOS, PCI-X, GTL+, SSTL-2/3, HSTL, LVDS, LVPECL | — |
| LVDS Data Rate | 1 Gbps | — |
| PLL Count | 4 | — |
| Embedded Memory | ESB blocks (dual-port RAM, FIFO, CAM, ROM) | ESBs for dual-port RAM, ROM, FIFO |
| I/O Banks | 16 | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Tindminan RoHS | Non-compliant (legacy product) | [DATA_NEEDED] |
| Logic Elements (LE) | — | Approximately 25,000 |
| Macro Cells | — | 2432 |
| User I/O | — | 492 |
| Package Dimensions | — | 27 mm x 27 mm |
| Ball Pitch | — | 1.0 mm |
| Logic Family | — | CMOS |
| Propagation Delay | — | 1.69 ns |
| Volte ng Pagbibigay | — | [DATA_NEEDED: core VCC voltage] |
| I/O Standards | — | LVTTL, LVCMOS, PCI, LVDS, HSTL, SSTL (multi-voltage 1.5/1.8/2.5/3.3 V) |
| Configuration | — | Passive Serial, Passive Parallel Synchronous, JTAG |