EP2A25F672C9N vs EP2A25F672C7N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2A25F672C9N sa pamamagitan ng Intel at EP2A25F672C7N sa pamamagitan ng Altera. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP2A25F672C9N | EP2A25F672C7N |
|---|---|---|
| Brand | Intel | Altera |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Obsolete | Obsolete |
| Family | APEX II | APEX II |
| Logic Elements / Cells | 24320 | — |
| System Gates | Approx. 900000 | Approximately 900,000 |
| Maximum User I/O | 492 | — |
| Operating Frequency | 236 MHz | — |
| Core Supply Voltage (VCCINT) | 1.425 V to 1.575 V (nominal 1.5 V) | — |
| Process Technology | 0.15 µm all-layer copper, up to 8 metal layers | 0.15 µm all-layer copper (up to 8 metal layers) |
| Packhaging | 672-ball FineLine BGA (F672), 27 × 27 mm, 1.00 mm pitch | — |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount |
| Seated Height (max) | 2.100 mm | — |
| Propagation Delay | 2.23 ns | — |
| Logic Family | CMOS | CMOS |
| Temperature na Operasyon | 0 °C to +85 °C (commercial, C9 grade) | 0 °C to 85 °C (commercial) |
| I/O Standards Supported | LVTTL, LVCMOS, PCI, GTL+, SSTL-2/3, LVDS, LVPECL, PCML, HyperTransport | — |
| LVDS Data Rate | Up to 1 Gbps (True-LVDS) | — |
| Configuration Interface | Serial / Parallel PROM, JTAG, passive parallel (enhanced) | — |
| Embedded Memory | Enhanced System Blocks (ESBs) for dual-port RAM | Embedded System Blocks (ESB) configurable as dual-port RAM/ROM |
| Design Software | Quartus II (v5.1 or later) | — |
| Tindminan RoHS | Compliant (per distributor listings) | [DATA_NEEDED: RoHS compliance] |
| Logic Elements | — | 24,320 cells |
| User I/Os | — | 492 |
| Propagation Delay (tPD) | — | 1.69 ns |
| Internal Operating Frequency | — | Up to 500 MHz |
| Core Voltage (VCCINT) | — | 1.5 V |
| Package Type | — | 672-ball FC-FBGA (FineLine BGA) |
| Package Body Size | — | 27 x 27 mm |
| Ball Pitch | — | 1.0 mm |
| High-Speed I/O Support | — | True-LVDS, LVPECL, PCML, HyperTransport up to 1 Gbps |
| Programmable Logic Type | — | Loadable PLD (in-system programmable) |
| PLLs | — | Up to 4 |