EP2A25F672I-7 vs EP2A25F672C8N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2A25F672I-7 sa pamamagitan ng Intel at EP2A25F672C8N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP2A25F672I-7 | EP2A25F672C8N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Obsolete | NRND |
| Family | APEX II | APEX II |
| Manufacturer | Intel (formerly Altera) | — |
| Device Type | FPGA (Field-Programmable Gate Array) | — |
| System Gates | 900K (approximately) | 900,000 |
| Logic Cells / Elements | 24,320 | — |
| Maximum Operating Frequency | 500 MHz | — |
| Process Technology | 0.15 um | — |
| Core Voltage | 1.5 V | — |
| Packhaging | 672-pin FC-FBGA | 672-ball FC-FBGA (FineLine BGA) |
| Uri ng Pagpapasok | Surface Mount (Flip-Chip BGA) | Surface Mount |
| Speed Grade | -7 | C8 |
| Temperature na Operasyon | -40C to +85C (Industrial) | 0 C to 85 C (commercial) |
| Temperature Grade | Industrial (I) | — |
| Configuration Method | JTAG, Passive Serial, Active Serial | — |
| JTAG Support | IEEE 1149.1 Boundary Scan | — |
| Tindminan RoHS | [DATA_NEEDED: rohs status] | Compliant |
| Level ng MSL | [DATA_NEEDED: MSL level] | — |
| Embedded Memory | ESBs (Embedded System Blocks) | — |
| Technology Node | — | 0.15 um all-layer copper process |
| Logic Elements / Cells | — | 24,320 |
| Maximum Internal Frequency | — | 333 MHz |
| Propagation Delay | — | 1.69 ns |
| User I/Os | — | 492 |
| Package Body Size | — | 27 x 27 mm |
| Ball Pitch | — | 1.0 mm |
| Core Supply Voltage | — | 1.5 V |
| Multi-Gigabit Transceiver Rate | — | Up to 1 Gbps per channel |
| Lead-Free Suffix | — | N (lead-free, Pb-free finish) |