EP2A25F672I8N vs EP2A25F672C9N Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP2A25F672I8N sa pamamagitan ng Intel at EP2A25F672C9N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EP2A25F672I8N EP2A25F672C9N
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Huling Pagbili Obsolete
Family APEX II APEX II
Device EP2A25 —
Logic Elements 24,320 —
Gates 900,000 —
Embedded Memory (bits) 622,592 —
User I/Os 492 —
Packhaging 672-ball FC-FBGA (FineLine BGA) 672-ball FineLine BGA (F672), 27 × 27 mm, 1.00 mm pitch
Package Size 27 x 27 mm —
Ball Pitch 1 mm —
Process Technology 0.15 µm all-layer copper-metal 0.15 µm all-layer copper, up to 8 metal layers
Metal Layers Up to 8 —
Core Voltage (VCCINT) 1.5 V —
Internal Frequency (max) 333 MHz —
Propagation Delay 1.69 ns 2.23 ns
Temperature na Operasyon 0 °C to 85 °C 0 °C to +85 °C (commercial, C9 grade)
Logic Family CMOS CMOS
I/O Standards Supported True-LVDS, LVPECL, PCML, HyperTransport LVTTL, LVCMOS, PCI, GTL+, SSTL-2/3, LVDS, LVPECL, PCML, HyperTransport
Configuration Method SRAM-based (Altera Quartus II) —
Tindminan RoHS unknown Compliant (per distributor listings)
Lead-Free unknown —
Logic Elements / Cells — 24320
System Gates — Approx. 900000
Maximum User I/O — 492
Operating Frequency — 236 MHz
Core Supply Voltage (VCCINT) — 1.425 V to 1.575 V (nominal 1.5 V)
Uri ng Pagpapasok — Surface Mount (BGA)
Seated Height (max) — 2.100 mm
LVDS Data Rate — Up to 1 Gbps (True-LVDS)
Configuration Interface — Serial / Parallel PROM, JTAG, passive parallel (enhanced)
Embedded Memory — Enhanced System Blocks (ESBs) for dual-port RAM
Design Software — Quartus II (v5.1 or later)

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