EP2A40F33I-9 vs EP2A40F33C-9 Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP2A40F33I-9 sa pamamagitan ng Altera at EP2A40F33C-9 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EP2A40F33I-9 EP2A40F33C-9
Brand Altera Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Obsolete NRND
Family APEX II APEX II
Typical Gate Count 1,500,000 —
Logic Elements 40,000 (per legacy marketing) [DATA_NEEDED: exact LE count]
Packhaging 33-ball FineLine BGA (F33) 672-ball FineLine BGA (F33), 1.27 mm pitch
Hanay ng Temperature na Operasyon -40C to +100C (Industrial) —
Speed Grade -9 (fastest grade for this package) -9
Supply Voltage - Core [DATA_NEEDED: core voltage] —
I/O Voltage Support 1.5V / 1.8V / 2.5V / 3.3V (MultiVolt) —
Differential I/O LVDS (per APEX II family features) —
Uri ng Pagpapasok Surface Mount (BGA) Surface Mount (BGA)
Level ng Sensitivity sa Asid ng Moisture (MSL) 3 —
Peak Reflow Temperature 220 C 220 C
Tindminan RoHS ROHS3 Compliant (per Alibaba listing) [DATA_NEEDED: not stated in provided data]
Device Family Prefix EP2A40 (APEX II, density 40) —
Manufacturer Altera (now Intel Programmable Solutions Group) —
Maximum System Gates — 1,600,000
Embedded RAM — 65 Kbytes (approximately 540 Kbits depending on configuration)
Temperature na Operasyon — 0C to +85C (commercial)
Process Technology — 0.15 micrometer CMOS
PLLs — 4
LVDS Channels — 16 high-speed LVDS channels
Maximum User I/O — [DATA_NEEDED: max user I/O count]
Multi-Core Architecture — MegaLAB structure with embedded memory and CAM
Configuration Method — JTAG, serial PROM, parallel flash
Level ng MSL — 3
Core Voltage — [DATA_NEEDED: nominal core voltage]

Mga Datasheets at Resources

Tingnan ang Lahat ng mga Produkto Lumikha ng BOM Hilingin ang Kita