EP2A40F672C8N vs EP2A40F672C6N Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP2A40F672C8N sa pamamagitan ng Intel at EP2A40F672C6N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EP2A40F672C8N EP2A40F672C6N
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Obsolete Obsolete
Family APEX II APEX II
Series EP2A40 —
Logic Family CMOS —
System Gates 1.5 M —
Logic Elements / Cells 38,400 —
Maximum Operating Frequency 376 MHz —
Propagation Delay 1.55 ns —
Technology Node 0.15 µm —
Process Feature All-layer copper, up to 8 metal layers —
Nominal Supply Voltage (VCCINT) 1.5 V —
Supply Voltage Range 1.425 V to 1.575 V —
User I/Os 492 —
Number of Pins / Balls 672 —
Package Type FC-FBGA (FineLine BGA) —
Package Dimensions 27 x 27 mm —
Ball Pitch 1.0 mm —
LVDS Data Rate 1 Gbps —
Embedded PLLs 4 —
Programming Interface JTAG (IEEE 1149.1) —
Operating Temperature (Commercial) 0 °C to 85 °C —
Speed Grade C8 C6 (per part number suffix)
Tindminan RoHS [DATA_NEEDED: RoHS status] [DATA_NEEDED: RoHS compliance status]
Logic Elements — 40,000
Maximum System Gates — 1,125,000
Embedded RAM Bits — 442,368
Embedded System Blocks (ESBs) — 160
Maximum User I/O Pins — [DATA_NEEDED: maximum user I/O count]
Core Voltage — 1.5 V
I/O Standards Supported — LVTTL, LVCMOS, PCI, GTL+, SSTL, HSTL, 1.8V/2.5V/3.3V/5V
Packhaging — 672-ball FineLine BGA
Temperature na Operasyon — Commercial (0C to +85C)
Configuration Methods — Passive Serial, Passive Parallel, JTAG
Uri ng Pagpapasok — Surface Mount
Process Technology — SRAM-based, 0.18 um (per family datasheet)
PLL Count — [DATA_NEEDED: PLL count]

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