EP2A70B724C9ES vs EP2A70B724C7 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2A70B724C9ES sa pamamagitan ng Intel at EP2A70B724C7 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP2A70B724C9ES - APEX II FPGA 3M Gates 67200 Cells 724-FCBGA | Intel
EP2A70B724C9ES ⚠ Huling PagbiliPagsanggunian na paghahambing
| Parametro | EP2A70B724C9ES | EP2A70B724C7 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Huling Pagbili | Unknown |
| Manufacturer | Intel (formerly Altera) | — |
| Series | APEX II | — |
| Logic Elements / Cells | 67200 | — |
| System Gates | 3,000,000 (3M) | — |
| Embedded Memory (bits) | 1,146,880 | — |
| Maximum User I/O | 540 | — |
| Operating Frequency (max) | 198 MHz | — |
| Core Voltage | 1.5 V | — |
| Process Technology | 0.15 µm CMOS | — |
| Packhaging | 724-BBGA, FCBGA | 724-pin FCBGA, 724-BBGA, or PBGA724 |
| Uri ng Pagpapasok | Surface Mount | — |
| Temperature na Operasyon | [DATA_NEEDED: operating temperature range] | [DATA_NEEDED: operating-temperature range] |
| Level ng MSL | [DATA_NEEDED: MSL level] | — |
| Tindminan RoHS | [DATA_NEEDED: RoHS status] | unknown |
| I/O Standards Supported | LVTTL, LVCMOS, SSTL, HSTL, PCI, LVDS | — |
| Configuration Method | Serial or parallel (via Altera configuration devices) | — |
| Device Type | — | FPGA (Field Programmable Gate Array) |
| Family | — | APEX II |
| Gate Count | — | 3,000,000 gates |
| Logic Cells | — | 67,200 cells |
| I/O Count | — | 540 I/O |
| Configuration or Memory Capacity | — | [DATA_NEEDED: exact embedded-memory or configuration-memory capacity] |
| Volte ng Pagbibigay | — | 1.5 V |
| Maximum Frequency | — | 420 MHz |
| Fabrication Process | — | 0.15 µm |
| Loadable PLD Timing | — | 2.17 ns |
| Technology | — | CMOS |
| Package Body Size | — | 35 mm x 35 mm |
| Package Pitch | — | 1.27 mm |
| Interface Capabilities | — | True-LVDS, LVPECL, PCML, and HyperTransport |
| REACH Status | — | unknown |
| AEC-Q100 Status | — | unknown |
| Lead-Free Status | — | unknown |