EP2A70B724I-9 vs EP2A70B724I-8 Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP2A70B724I-9 sa pamamagitan ng Altera at EP2A70B724I-8 sa pamamagitan ng Altera. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EP2A70B724I-9 EP2A70B724I-8
Brand Altera Altera
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Obsolete Obsolete
Family APEX II APEX II
Logic Elements (typical) 70,000 —
Embedded RAM (ESB bits) 4,290 Kbit —
Maximum User I/O [DATA_NEEDED: max user I/O count] —
Packhaging BGA-724 —
Speed Grade -9 —
Temperature na Operasyon -40C to +100C (industrial, 'I' suffix) -40 °C to +100 °C (Industrial)
Process Node [DATA_NEEDED: process node] —
Supply Voltage Core 1.5 V (typical) —
Supply Voltage I/O 3.3 V (typical, multi-voltage I/O banks supported) —
Configuration Method Passive Serial, Passive Parallel, EPC4/EPC8/EPC16 enhanced configuration devices JTAG / Passive Serial / Passive Parallel
Peak Reflow Temperature 220 C 220 °C (per JEDEC J-STD-020)
Uri ng Pagpapasok Surface Mount (BGA) Surface Mount
Level ng MSL [DATA_NEEDED: MSL rating] [DATA_NEEDED: MSL level]
Tindminan RoHS unknown [DATA_NEEDED: RoHS compliance]
Logic Elements / Cells — 67,200 cells
System Gates — 3,000,000
Maximum Internal Frequency — 281 MHz
Process Technology — 0.15 µm CMOS
Core Supply Voltage — 1.5 V
I/O Supply Voltage — 3.3 V
Bilang ng Pins — 724
Package Type — FCBGA (Flip-Chip Ball Grid Array)
User I/O Banks — [DATA_NEEDED: user I/O bank count]
User I/O Pins — [DATA_NEEDED: user I/O pin count]
Embedded System Blocks (ESBs) — [DATA_NEEDED: ESB count]
Embedded Array Blocks (EABs) — [DATA_NEEDED: EAB count]
Embedded RAM — [DATA_NEEDED: total bits]
PLLs — [DATA_NEEDED: PLL count]

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