EP2AGX45CU17I3G vs EP2AGX45CU17C4G Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2AGX45CU17I3G sa pamamagitan ng Intel at EP2AGX45CU17C4G sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP2AGX45CU17C4G - Arria II GX FPGA, 42K LE, 156 I/O, 358-BGA | Intel
EP2AGX45CU17C4G ✓ NakahandaPagsanggunian na paghahambing
| Parametro | EP2AGX45CU17I3G | EP2AGX45CU17C4G |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Arria II GX | Arria II GX |
| Logic Elements | 42,959 | 42,959 |
| Logic Array Blocks (LABs) | 1,805 | — |
| Total RAM Bits | 3,517,440 | 3,517,440 |
| User I/O Pins | 156 | — |
| Number of I/O Banks | [DATA_NEEDED: number of I/O banks] | [DATA_NEEDED: I/O banks count] |
| Transceivers | Up to 8 channels | — |
| Transceiver Data Rate | Up to 3.125 Gbps | — |
| Process Technology | 40 nm | 40 nm |
| Core Voltage (Vcc) | 1.0 V (0.9 V internal) | — |
| PLLs | 4 | — |
| DSP Blocks | Yes (variable-precision DSP) | — |
| Temperature na Operasyon | -40C to +100C (Industrial) | 0C to +85C (Commercial) |
| Packhaging | 358-ball UBGA (FCBGA), 17x17 mm | 358-LFBGA, FCBGA |
| Ball Pitch | 1.0 mm | — |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount |
| Level ng MSL | 3 (168 hours) | — |
| Tindminan RoHS | Compliant | Compliant |
| Embedded Memory Bits | — | 3,517,440 |
| Number of LABs/CLBs | — | 1805 |
| User I/O Count | — | 156 |
| Supply Voltage - Core | — | 0.9 V |
| Speed Grade | — | -4 |
| Transceiver Data Rate (max) | — | [DATA_NEEDED: max Gbps] |
| Number of Transceivers | — | [DATA_NEEDED: transceiver count] |
| Lead-Free | — | Yes |