EP2AGX45DF25I3G vs EP2AGX45DF25I5G Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP2AGX45DF25I3G sa pamamagitan ng Intel at EP2AGX45DF25I5G sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EP2AGX45DF25I3G EP2AGX45DF25I5G
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Aktibo NRND
Family Arria II GX Arria II GX
Logic Elements (LE) 42,959 42,959
Adaptive Logic Modules (ALM) 17,715 —
Embedded Memory Bits 3,517,440 bits —
Embedded Memory M9K Blocks [DATA_NEEDED: M9K block count] —
DSP Blocks (18x18 multipliers) [DATA_NEEDED: DSP block count] —
Maximum User I/O Pins 252 —
Transceiver Channels [DATA_NEEDED: MGT channel count] —
Maximum Transceiver Data Rate 6.375 Gbps —
Packhaging 572-ball FCBGA (HBGA) 572-FBGA (FC-FBGA, 25 mm × 25 mm, 1.0 mm pitch)
Package Dimensions 25 mm x 25 mm —
Hanay ng Temperature na Operasyon -40C to +100C (Industrial) —
Speed Grade I3 I5
Process Node 40 nm —
Supply Voltage (Core) [DATA_NEEDED: VCCINT] —
Hard IP for PCIe PCIe Gen1/Gen2 endpoints and root ports —
Uri ng Pagpapasok Surface Mount (BGA) Surface Mount
Level ng MSL 3 [DATA_NEEDED: MSL level]
Tindminan RoHS Compliant Compliant (Pb-free)
Lead-Free Yes —
User I/O Count — 252
Process Technology — 40 nm
Core Voltage — 0.9 V
Maximum Fabric Frequency — 500 MHz
Transceivers — Up to 3.125 Gbps
Embedded Memory — 2.7 Mbits
Embedded 18×18 Multipliers — 156
PCIe Hard IP — PCI Express Gen1 (×1, ×4, ×8)
Temperature na Operasyon — -40 °C to +100 °C (industrial)

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