EP2AGX45DF29I6N vs EP2AGX45DF29I3N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2AGX45DF29I6N sa pamamagitan ng Intel at EP2AGX45DF29I3N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP2AGX45DF29I6N | EP2AGX45DF29I3N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | NRND | Huling Pagbili |
| Device Family | Arria II GX | — |
| Device Sub-family | EP2AGX45 | — |
| Logic Elements | 42,960 | — |
| Embedded Memory | 1,728 Kbits (M9K + M144K) | — |
| User I/O Pins | 364 | — |
| Transceiver Channels | 8 (up to 6.375 Gbps) | — |
| Hard PCIe IP | PCIe Gen1/Gen2 x1/x4 endpoints | — |
| Hard Memory Controller | DDR3 (with soft PHY) | — |
| Packhaging | 780-ball FCBGA (FineLine BGA, DF29 pin-out) | 780-ball FC-FBGA (DF29) |
| Speed Grade | 6 (fastest transceiver bin) | I3 |
| Temperature Grade | Industrial (-40C to +100C) | — |
| Process Node | 40 nm TSMC | — |
| Logic Element Structure | 8-input ALM (Adaptive Logic Module) | — |
| Tindminan RoHS | Compliant | Compliant |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount (flip-chip BGA) |
| Family | — | Arria II GX |
| Series | — | EP2AGX45 |
| Number of Logic Elements | — | 42,959 |
| Number of LABs/CLBs | — | 1,805 |
| Total RAM Bits | — | 3,517,440 |
| Number of User I/O | — | 364 |
| Temperature na Operasyon | — | -40 C to +100 C (industrial) |
| Process Technology | — | 40 nm |
| Core Voltage | — | 0.9 V |
| Transceivers | — | Up to 8 channels, 3.125 Gbps |
| Hard PCIe Controller | — | PCIe Gen1/Gen2 x1/x4 |
| Maximum User I/O Frequency | — | 500 MHz Fmax |
| Embedded Multipliers | — | [DATA_NEEDED: 18x18 multiplier count] |
| External Memory Support | — | DDR2, DDR3, QDRII+, RLDRAM II |