EP2AGX45DF29I6N vs EP2AGX45DF29I5N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2AGX45DF29I6N sa pamamagitan ng Intel at EP2AGX45DF29I5N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP2AGX45DF29I6N | EP2AGX45DF29I5N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | NRND | Aktibo |
| Device Family | Arria II GX | Arria II GX |
| Device Sub-family | EP2AGX45 | — |
| Logic Elements | 42,960 | 42,959 |
| Embedded Memory | 1,728 Kbits (M9K + M144K) | — |
| User I/O Pins | 364 | — |
| Transceiver Channels | 8 (up to 6.375 Gbps) | — |
| Hard PCIe IP | PCIe Gen1/Gen2 x1/x4 endpoints | — |
| Hard Memory Controller | DDR3 (with soft PHY) | — |
| Packhaging | 780-ball FCBGA (FineLine BGA, DF29 pin-out) | — |
| Speed Grade | 6 (fastest transceiver bin) | — |
| Temperature Grade | Industrial (-40C to +100C) | — |
| Process Node | 40 nm TSMC | — |
| Logic Element Structure | 8-input ALM (Adaptive Logic Module) | — |
| Tindminan RoHS | Compliant | Compliant |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount |
| Logic Array Blocks (LABs) | — | 1,805 |
| Embedded Memory (M9K blocks) | — | 3,517,440 bits |
| User I/Os | — | 364 |
| Number of I/O Banks | — | [DATA_NEEDED: number of I/O banks] |
| Transceivers | — | [DATA_NEEDED: number of transceiver channels] |
| Max Transceiver Data Rate | — | 3.75 Gbps |
| PLLs | — | 4 |
| Process Technology | — | 40 nm |
| Core Supply Voltage | — | 0.9 V |
| Temperature na Operasyon | — | -40C to +100C (industrial) |
| Package Type | — | 780-ball FC-FBGA |
| Package Dimensions | — | 29 mm x 29 mm |
| Level ng MSL | — | 3 |
| Lead-Free | — | Yes |