EP2AGX65DF29C6 vs EP2AGX65DF29C3N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2AGX65DF29C6 sa pamamagitan ng Intel at EP2AGX65DF29C3N sa pamamagitan ng Altera. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP2AGX65DF29C6 - Arria II GX FPGA, 60K LE, 364 I/O, 780-FCBGA | Intel
EP2AGX65DF29C6 ✓ Nakahanda
Pagsanggunian na paghahambing
| Parametro | EP2AGX65DF29C6 | EP2AGX65DF29C3N |
|---|---|---|
| Brand | Intel | Altera |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Unknown |
| Family | Arria II GX | — |
| Logic Elements (LE) | 60,214 | — |
| Logic Array Blocks (LABs) | 2,530 | — |
| Adaptive Logic Modules (ALMs) | [DATA_NEEDED: ALM count] | — |
| Embedded Memory (bits) | 5,371,904 | — |
| Maximum User I/O | 364 | — |
| DSP Blocks (18x18 Multipliers) | [DATA_NEEDED: DSP block count] | — |
| Transceivers | 8 (up to 3.75 Gbps per Arria II GX family spec) | — |
| PLLs | 4 | — |
| Core Voltage | 0.9 V | — |
| Process Technology | 40 nm | — |
| Speed Grade | 6 (C6) | — |
| Temperature na Operasyon | Commercial (0C to +85C) | [DATA_NEEDED: operating temperature range] |
| Packhaging | 780-ball FC-FBGA (29x29 mm) | FBGA-572 |
| Uri ng Pagpapasok | Surface Mount (flip-chip BGA) | Surface Mount |
| Level ng MSL | [DATA_NEEDED: MSL level] | — |
| Tindminan RoHS | Compliant | [DATA_NEEDED: RoHS status] |
| Device Type | — | Field Programmable Gate Array (FPGA) |
| Product Family | — | Arria II GX |
| Logic Elements | — | 60,214 |
| Embedded Memory | — | 602,214 bit |
| User I/O Pins | — | 364 |
| Package Designation | — | DF29 |
| Total Pins or Balls | — | 572 |
| Volte ng Pagbibigay | — | 0.9 V |
| Technology | — | 65 nm |
| Transceiver Count | — | [DATA_NEEDED: integrated transceiver count] |
| Maximum I/O Frequency | — | [DATA_NEEDED: maximum I/O operating frequency] |