EP2AGZ225FF35I3N vs EP2AGZ225FF35I4N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2AGZ225FF35I3N sa pamamagitan ng Intel at EP2AGZ225FF35I4N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP2AGZ225FF35I3N | EP2AGZ225FF35I4N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Arria II GZ | Arria II GZ |
| Logic Elements (LE) | 224,000 | — |
| Embedded Memory | 14,248,960 bits (approx. 14.25 Mbit) | — |
| Logic Array Blocks (LABs) | 8,960 | — |
| User I/O Count | 554 | — |
| Maximum Transceiver Data Rate | 6.375 Gbps | — |
| Transceiver Channels | 24 | — |
| Process Technology | 40 nm | 40 nm |
| Core Voltage | 0.9 V | — |
| Temperature na Operasyon | -40C to +100C (Industrial) | -40C to +100C (Industrial) |
| Packhaging | 1152-ball FC-FBGA | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Level ng MSL | [DATA_NEEDED: MSL rating] | [DATA_NEEDED: MSL Level] |
| Tindminan RoHS | [DATA_NEEDED: RoHS status] | — |
| Configuration Method | SRAM-based (volatile, requires external config device) | — |
| Maximum User I/O | 554 | — |
| Logic Elements (LEs) | — | 224000 |
| Number of LABs/CLBs | — | 8960 |
| Total Memory Bits | — | 14248960 |
| Number of I/O | — | 554 |
| Supply Voltage - Core | — | 0.9 V |
| Maximum Operating Frequency | — | 500 MHz |
| Packhaging / Kaso | — | 1152-BBGA, FCBGA |
| Package Dimensions | — | 35 mm x 35 mm |
| Lead Free / RoHS | — | Lead Free / RoHS Compliant |
| Temperature Grade | — | Industrial (I4) |