EP2AGZ225HF40C4N vs EP2AGZ225HF40I3N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2AGZ225HF40C4N sa pamamagitan ng Intel at EP2AGZ225HF40I3N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP2AGZ225HF40C4N | EP2AGZ225HF40I3N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Arria II GZ | Arria II GZ |
| Logic Elements | 224,000 | — |
| Logic Array Blocks (LABs) | 8,960 | 8,960 |
| Adaptive Logic Modules (ALMs) | 89,600 | — |
| Embedded Memory Bits | 14,248,960 | — |
| User I/O Pins | 734 | — |
| Number of Package Pins | 1517 | — |
| Package Type | FBGA (FineLine BGA) | 1517-BBGA, FCBGA (flip-chip BGA) |
| Package Code | HF40 | — |
| Operating Temperature Grade | Commercial (0C to +85C) | — |
| Temperature Range | -40C to +85C | — |
| Process Node | 40 nm | — |
| Transceiver Data Rate | Up to 6.375 Gbps | — |
| DSP Blocks | Yes (18x19 multiplier mode) | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Lead Free / RoHS Status | Lead Free / RoHS Compliant | — |
| Logic Elements (LE) | — | 224,000 |
| Embedded Memory (bits) | — | 14,248,960 |
| User I/O | — | 734 |
| Embedded Multipliers (18x18) | — | 736 |
| Transceiver Data Rate (max) | — | 6.375 Gbps |
| Speed Grade | — | I3 (industrial, -3) |
| Temperature na Operasyon | — | -40C to +100C (industrial) |
| Process Technology | — | 40 nm TSMC |
| Configuration Memory | — | SRAM-based, volatile (requires external configuration device) |
| PCIe Hard IP | — | PCIe Gen1/Gen2 |
| Supply Voltage (Core) | — | [DATA_NEEDED: core voltage] |
| Tindminan RoHS | — | [DATA_NEEDED: RoHS status] |