EP2AGZ300FF35C3G vs EP2AGX260FF35C5G Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP2AGZ300FF35C3G sa pamamagitan ng Intel at EP2AGX260FF35C5G sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EP2AGZ300FF35C3G EP2AGX260FF35C5G
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Aktibo NRND
Series Arria II GZ Arria II GX
Logic Elements 300,000 244,188
Adaptive Logic Modules (ALMs) 119,088 [DATA_NEEDED: ALM count]
Embedded Memory 17,133 Kbit —
DSP Blocks 16-bit x 18-bit x 18-bit multipliers, integer/fractional modes [DATA_NEEDED: DSP block count]
Transceivers 16 channels, up to 6.375 Gbps —
Hard PCIe Controllers Up to 12 (Gen2 endpoint/root-port) —
User I/Os 1,288 —
I/O Banks 12 —
Process Technology 40 nm TSMC —
Packhaging FCBGA-1152 (35 mm) 1152-ball FCBGA (FF35)
Package Family BGA (Flip-Chip) —
Temperature Grade Commercial (0 C to 85 C junction) Commercial (0C to +85C)
Speed Grade 3 (mid-performance) C5 (mid-speed)
Configuration Method Quartus II/Prime, JTAG, Passive Serial, Fast Passive Parallel —
Hard Memory Controller DDR3 up to 800 MHz, DDR2, QDR II+ —
Tindminan RoHS Compliant —
Family — Arria II GX (EP2AGX260)
Embedded Memory (bits) — 12,038,144
Maximum User I/O — 612
Number of Transceivers — [DATA_NEEDED: transceiver count]
Transceiver Data Rate — Up to 6.375 Gbps
Package Code — BBGA / HBGA
Uri ng Pagpapasok — Surface Mount (BGA)
Volte ng Pagbibigay — [DATA_NEEDED: core/rail voltages]
Lead-Free / RoHS — RoHS compliant (G suffix)
Process Node — 40 nm

Mga Datasheets at Resources

Tingnan ang Lahat ng mga Produkto Lumikha ng BOM Hilingin ang Kita