EP2AGZ300FH29C4N vs EP2AGZ350FH29C4G Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2AGZ300FH29C4N sa pamamagitan ng Intel at EP2AGZ350FH29C4G sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP2AGZ300FH29C4N | EP2AGZ350FH29C4G |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Arria II GZ | Arria II GZ |
| Logic Elements (LE) | 298,000 | — |
| Logic Array Blocks (LABs) | 11,920 | — |
| Adaptive Logic Modules (ALMs) | 119,200 | — |
| Embedded Memory (bits) | 18,854,912 | — |
| User I/O Pins | 281 | — |
| DSP Blocks | [DATA_NEEDED: exact DSP block count for EP2AGZ300] | — |
| Transceivers | Up to 28 (up to 6.375 Gbps) | 16 (8.5 Gbps) |
| Core Voltage | 0.9 V | — |
| Process Node | 40 nm | 40 nm |
| Packhaging | 780-ball FC-HFBGA (FH29) | 780-ball Flip-Chip BGA (FH29) |
| Speed Grade | C4 | C4 |
| Temperature Grade | Industrial (N suffix) | — |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount (BGA) |
| Tindminan RoHS | Compliant | Compliant |
| Logic Elements (LEs) | — | 350,000 |
| M20K Block RAM (bits) | — | 18,424 Kbits |
| MLAB Memory (bits) | — | 1,425 Kbits |
| Embedded Multipliers (18x18) | — | 1,152 |
| Maximum User I/O | — | 552 |
| Temperature na Operasyon | — | 0C to +85C (Commercial) |
| Transceiver Grade | — | -4 |
| Lead-Free | — | Yes |