EP2AGZ350FF35I4N vs EP2AGZ350FF35C4N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2AGZ350FF35I4N sa pamamagitan ng Intel at EP2AGZ350FF35C4N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP2AGZ350FF35I4N | EP2AGZ350FF35C4N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | NRND |
| Family | Arria II GZ | Arria II GZ |
| Logic Elements (LE) | 348,500 | 348,500 |
| Embedded Memory | 21,270,528 bits (21.27 Mbit) | — |
| Logic Array Blocks (LABs) | 13,940 | 13,940 |
| User I/O Pins | 554 | — |
| Maximum User I/O | 554 | — |
| Packhaging | 1152-ball FC-FBGA (35 mm x 35 mm) | 1152-ball FC-FBGA |
| Process Technology | 40 nm CMOS | 40 nm |
| Core Voltage | 0.9 V | 0.9 V |
| Speed Grade | I4 (industrial) | C4 |
| Temperature na Operasyon | -40C to +100C (industrial) | Commercial (0C to +85C) |
| Embedded 18x18 Multipliers | 720 | — |
| Transceivers | Up to 16 high-speed transceivers (per family) | — |
| Maximum Transceiver Data Rate | 6.375 Gbps | — |
| Tindminan RoHS | Compliant (LEAD FREE per datasheet) | — |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount (Flip-Chip BGA) |
| Embedded Memory (bits) | — | 21,270,528 |
| User I/Os | — | 554 |
| Maximum Fabric Frequency | — | 500 MHz |
| Package Dimensions | — | 35 x 35 mm |
| Lead-Free / RoHS | — | Lead Free |
| Level ng MSL | — | [DATA_NEEDED: MSL rating] |