EP2AGZ350FH29C3G vs EP2AGZ300FH29C3G Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2AGZ350FH29C3G sa pamamagitan ng Intel at EP2AGZ300FH29C3G sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP2AGZ350FH29C3G | EP2AGZ300FH29C3G |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Logic Elements | 350,000 | 300,000 |
| Adaptive Logic Modules (ALMs) | [DATA_NEEDED: ALM count] | — |
| Embedded Memory (Bits) | 16,402,944 | — |
| Embedded Memory Blocks | [DATA_NEEDED: M9K/M144K block count] | — |
| User I/O Pins | 281 | — |
| Transceivers | 24 channels | Yes (multi-gigabit) |
| Transceiver Data Rate (max) | 8.5 Gbps | — |
| PCI Express Hard IP | 4 x PCIe Gen2 (x1/x4) | — |
| External Memory Interface | DDR3 up to 800 MHz, DDR2, QDRII+ | — |
| PLLs | 8 (4 enhanced, 4 fast) | — |
| Global Clocks | 16 | — |
| Process Node | 40 nm TSMC | 40 nm |
| Speed Grade | C3 (commercial, slowest) | 3 |
| Temperature ng Junction na Operasyon | 0C to +85C | — |
| Packhaging | 780-ball FBGA (HBGA, 29x29 mm) | 780-BGA (HBGA, 29 mm) |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Tindminan RoHS | Compliant | Compliant |
| Lead-Free | Yes | — |
| Level ng MSL | [DATA_NEEDED: MSL rating] | 3 (per JEDEC J-STD-020, where stated) |
| Series | — | Arria II GZ |
| Manufacturer | — | Intel (Altera) |
| Number of I/O | — | 281 |
| Temperature na Operasyon | — | 0C to +85C (commercial, speed grade 3) |
| Supply Voltage (Core) | — | [DATA_NEEDED: core voltage] |
| Embedded Memory | — | M9K / M144K block RAM |
| DSP Blocks | — | Yes (variable-precision DSP) |