EP2AGZ350HF40C3G vs EP2AGZ350HF40I3N Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP2AGZ350HF40C3G sa pamamagitan ng Intel at EP2AGZ350HF40I3N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EP2AGZ350HF40C3G EP2AGZ350HF40I3N
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Aktibo Aktibo
Family Arria II GZ Arria II GZ
Manufacturer Intel (formerly Altera) —
Logic Elements (LEs) 350,000 —
Embedded Memory [DATA_NEEDED: total embedded memory bits] —
DSP Blocks [DATA_NEEDED: DSP block count and 18x18 multiplier count] —
User I/O Pins 734 —
Packhaging 1517-ball FineLine BGA (HF40) 1517-ball FC-FBGA (HF40)
Package Pitch 1.0 mm —
Process Node 40 nm —
Speed Grade C3 (commercial, -3) I3
Temperature na Operasyon Commercial (0C to 85C, suffix 0C) —
Transceivers Up to 6.375 Gbps (channel count [DATA_NEEDED]) —
External Memory Interfaces DDR3, DDR2, QDR II+ (up to 800 MHz) —
PCI Express Hard Blocks Yes (Gen1/Gen2) —
Uri ng Pagpapasok Surface Mount (BGA) —
Tindminan RoHS Compliant Compliant (lead-free N suffix)
Lead-Free Yes Yes
Level ng MSL [DATA_NEEDED: MSL rating] —
Series — Arria II
Logic Elements (LE) — 348500
Logic Array Blocks (LABs) — 13940
User I/O Count — 734
Total Embedded Memory Bits — 21270528
Process Technology — 40 nm
Core Voltage — 0.9 V
Operating Temperature Grade — Industrial (-40C to +100C)
Package Code — BGA (Ball Grid Array)
Terminal Form — Ball
Number of Terminals — 1517
Package Shape — Square

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