EP2C35F672I8 vs EP2C35F672C6 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2C35F672I8 sa pamamagitan ng Intel at EP2C35F672C6 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP2C35F672I8 | EP2C35F672C6 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | NRND | NRND |
| Family | Cyclone II | Cyclone II |
| Manufacturer | Intel (formerly Altera) | — |
| Logic Elements | 33,216 | — |
| Embedded Memory (bits) | 483,840 | — |
| Embedded 18x18 Multipliers | 35 | — |
| User I/O Pins | 475 | — |
| PLLs | 4 | — |
| Process Technology | 90 nm CMOS SRAM | 90 nm CMOS |
| Packhaging | 672-ball FineLine BGA (FBGA) | — |
| Package Code | F672 | — |
| Ball Pitch | 1.0 mm | — |
| Operating Temperature (Industrial) | -40C to +100C Tj | — |
| Speed Grade | 8 (C8 core) | C6 |
| Supply Voltage (Core) | 1.15 V to 1.25 V | — |
| Supply Voltage (I/O) | 1.5 V / 1.8 V / 2.5 V / 3.3 V (multi-voltage) | — |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount |
| Tindminan RoHS | Compliant (lead-free FBGA) | [DATA_NEEDED: rohs compliance] |
| Logic Elements (LE) | — | 33,216 |
| Total RAM Bits | — | 483,840 |
| Number of I/O | — | 475 |
| Number of Logic Array Blocks (LABs) | — | 2,076 |
| Embedded Multipliers (18x18) | — | 70 |
| Number of PLLs | — | 4 |
| Supply Voltage - Core | — | 1.15 V to 1.25 V |
| Temperature na Operasyon | — | 0C to +85C (commercial) |
| Packhaging / Kaso | — | 672-BGA (FBGA) |
| Lead Free | — | [DATA_NEEDED: lead free status] |