EP2C5F256C8N vs EP2C5F256C6N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2C5F256C8N sa pamamagitan ng Intel at EP2C5F256C6N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP2C5F256C8N - Cyclone II FPGA, 4.6K LEs, 158 I/O | Altera / Intel
EP2C5F256C8N ⚠ Huling Pagbili
Pagsanggunian na paghahambing
| Parametro | EP2C5F256C8N | EP2C5F256C6N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Huling Pagbili | Obsolete |
| Family | Cyclone II | Cyclone II |
| Logic Elements (LE) | 4,608 | — |
| Logic Array Blocks (LAB) | 288 | — |
| Embedded Memory (M4K blocks) | 119,808 bits (~14.6 Kbytes) | — |
| Embedded 18x18 Multipliers | 13 | — |
| PLLs | 2 | 2 |
| Maximum User I/O Pins | 158 | — |
| Process Technology | 90 nm low-k CMOS | 90 nm CMOS |
| Core Voltage | 1.2 V | — |
| Speed Grade | 8 (commercial) | — |
| Packhaging | 256-ball FineLine BGA (FBGA-256) | 256-ball FineLine BGA (FBGA), 17x17 mm, 1.0 mm pitch |
| Temperature na Operasyon | 0C to +85C (commercial) | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Configuration Method | SRAM, JTAG (IEEE 1149.1), Passive Serial | JTAG, Active Serial (EPCS) |
| Level ng MSL | [DATA_NEEDED: MSL level per JEDEC J-STD-020] | 3 |
| Tindminan RoHS | Compliant (lead-free) | [DATA_NEEDED: rohs_status] |
| Logic Elements | — | 4,608 |
| Embedded Memory Bits | — | 119,808 bits |
| Embedded Memory Blocks (M4K) | — | 26 blocks of 4,608 bits |
| Maximum User I/Os | — | 158 |
| Core Voltage (VCCINT) | — | 1.2 V |
| I/O Voltage (VCCIO) | — | 1.5 V / 1.8 V / 2.5 V / 3.3 V (bank-dependent) |
| Operating Temperature (Commercial, C6) | — | 0C to +85C |