EP2C70F672C6N vs EP2C70F672C8KK Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2C70F672C6N sa pamamagitan ng Intel at EP2C70F672C8KK sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP2C70F672C6N | EP2C70F672C8KK |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | NRND | NRND |
| Family | Cyclone II | Cyclone II |
| Series | EP2C70 | — |
| Logic Elements | 68,416 | — |
| Logic Array Blocks (LABs) | 4,276 | — |
| Total RAM Bits | 1,152,000 | — |
| Embedded 18x18 Multipliers | 150 | 150 |
| PLLs | 4 | 4 |
| Maximum User I/O | 422 | 422 |
| I/O Banks | 8 | — |
| Packhaging | 672-ball FBGA, 27x27 mm, 1.0 mm pitch | 672-pin FBGA |
| Speed Grade | C6 | 8 (C8) |
| Temperature na Operasyon | 0C to +85C (commercial) | 0C to +85C (commercial) |
| Process Technology | 90 nm low-k CMOS, copper interconnect | 90 nm |
| Configuration Memory | SRAM (volatile) | — |
| Configuration Schemes | AS, AP, PS, JTAG | — |
| Supported I/O Standards | LVDS, LVTTL, LVCMOS, SSTL, HSTL | — |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount (BGA) |
| Tindminan RoHS | Lead-free (per FBGA marking) | Compliant |
| Logic Elements (LE) | — | 68,416 |
| Embedded Memory (Bits) | — | 1,152,000 (4,225 Kbits) |
| Global Clock Networks | — | 16 |
| Core Voltage | — | 1.2 V |
| Maximum Internal Frequency | — | 402.58 MHz |
| Configuration Method | — | Active Serial (AS), Passive Serial (PS), JTAG |