EP2C8AF256I8N vs EP2C8AF256A7N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2C8AF256I8N sa pamamagitan ng Intel at EP2C8AF256A7N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP2C8AF256A7N - Cyclone II FPGA, 8K LE, 256-FBGA | Intel / Altera
EP2C8AF256A7N ⚠ Huling PagbiliPagsanggunian na paghahambing
| Parametro | EP2C8AF256I8N | EP2C8AF256A7N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | NRND | Huling Pagbili |
| Presyo ng Yunit (USD) | $21.40 | — |
| Family | Cyclone II | Cyclone II |
| Logic Elements (LE) | 8,256 | 8,256 |
| Embedded Memory Bits | 165,888 bits (162 Kbit RAM) | 165,888 bits (162 Kbit) |
| Embedded Multipliers (18x18) | 36 | — |
| Maximum User I/O Pins | 182 | — |
| PLLs | 4 | 2 |
| Global Clocks | 16 | — |
| Configuration Elements | Embedded SRAM, JTAG, AS, PS | — |
| Core Voltage (VCCINT) | 1.2 V | 1.2 V |
| I/O Voltage (VCCIO) | 1.5 V / 1.8 V / 2.5 V / 3.3 V (bank-selectable) | — |
| Process Technology | 90 nm CMOS, SRAM-based | 90 nm TSMC low-k |
| Packhaging | 256-ball FBGA (FineLine BGA) | 256-ball FBGA (1.0 mm pitch) |
| Temperature na Operasyon | -40C to +100C (Industrial, I suffix) | — |
| Uri ng Pagpapasok | Surface Mount (BGA) | — |
| Tindminan RoHS | Lead-free (per Altera ordering code suffix) | Compliant |
| Speed Grade | 8 | 7 (A7) |
| Status Suffix | N (lead-free, Pb-free) | — |
| Embedded RAM Blocks | — | 36 M4K blocks (4 Kbit each) |
| Maximum User I/O | — | 182 |
| I/O Banks | — | 4 |
| Hardware Multipliers (18x18) | — | 18 |
| Maximum Internal Frequency | — | 402.58 MHz |
| Operating Temperature Grade | — | Automotive (A7N) |