EP2C8F256I8 vs EP2C8F256I8N Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP2C8F256I8 sa pamamagitan ng Intel at EP2C8F256I8N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EP2C8F256I8 EP2C8F256I8N
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Aktibo NRND
Series Cyclone II Cyclone II
Logic Elements 8,256 —
Total RAM Bits 165,888 165,888
Number of User I/O 182 —
Number of LABs / CLBs 516 —
Packhaging 256-LBGA (FBGA-256) —
Number of Terminals / Balls 256 —
Package Shape Square —
Temperature Grade Industrial (suffix 'I') —
Speed Grade 8 (per suffix) —
Core Supply Voltage [DATA_NEEDED: VCCINT voltage] 1.2 V
I/O Standard Support [DATA_NEEDED: Supported I/O standards] —
Number of PLLs [DATA_NEEDED: Number of PLLs] —
Configuration Methods [DATA_NEEDED: AS / PS / JTAG support details] —
Tindminan RoHS Unknown - no N suffix; verify in distributor data Compliant (Pb-free, lead-free reflow compatible)
Logic Elements (LEs) — 8,256
Embedded Memory Bits — 165,888 bits
Logic Blocks / Logic Cells — 540 (Logic Cells)
User I/O Pins — 182
Number of LABs/CLBs — [DATA_NEEDED: LAB count]
Embedded 18x18 Multipliers — Up to 36
PLLs — 2
Global Clock Networks — 16
I/O Supply Voltage — 1.5 V / 1.8 V / 2.5 V / 3.3 V (bank-dependent)
Process Technology — 90 nm CMOS (SRAM-based)
Package Type — 256-LBGA (FineLine BGA), 17x17 mm, 1.0 mm pitch
Temperature na Operasyon — -40C to +85C (industrial)
Configuration Method — SRAM, loaded from external EPCS flash at power-up
Uri ng Pagpapasok — Surface Mount (BGA)

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