EP2C8F256I8 vs EP2C8F256I8N 比較

詳細並排比較 EP2C8F256I8 由 Intel 與 EP2C8F256I8N 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

規格比較

參數 EP2C8F256I8 EP2C8F256I8N
品牌 Intel Intel
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 啟用中 NRND
Series Cyclone II Cyclone II
Logic Elements 8,256 —
Total RAM Bits 165,888 165,888
Number of User I/O 182 —
Number of LABs / CLBs 516 —
封裝 256-LBGA (FBGA-256) —
Number of Terminals / Balls 256 —
Package Shape Square —
Temperature Grade Industrial (suffix 'I') —
Speed Grade 8 (per suffix) —
Core Supply Voltage [DATA_NEEDED: VCCINT voltage] 1.2 V
I/O Standard Support [DATA_NEEDED: Supported I/O standards] —
Number of PLLs [DATA_NEEDED: Number of PLLs] —
Configuration Methods [DATA_NEEDED: AS / PS / JTAG support details] —
RoHS 狀態 Unknown - no N suffix; verify in distributor data Compliant (Pb-free, lead-free reflow compatible)
Logic Elements (LEs) — 8,256
Embedded Memory Bits — 165,888 bits
Logic Blocks / Logic Cells — 540 (Logic Cells)
User I/O Pins — 182
Number of LABs/CLBs — [DATA_NEEDED: LAB count]
Embedded 18x18 Multipliers — Up to 36
PLLs — 2
Global Clock Networks — 16
I/O Supply Voltage — 1.5 V / 1.8 V / 2.5 V / 3.3 V (bank-dependent)
Process Technology — 90 nm CMOS (SRAM-based)
Package Type — 256-LBGA (FineLine BGA), 17x17 mm, 1.0 mm pitch
工作溫度 — -40C to +85C (industrial)
Configuration Method — SRAM, loaded from external EPCS flash at power-up
安裝類型 — Surface Mount (BGA)

資料表與資源

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