EP2S130F1020I4N vs EP2S130F1020I4 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2S130F1020I4N sa pamamagitan ng Intel at EP2S130F1020I4 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP2S130F1020I4N - Stratix II 132K LEs FPGA, 742 I/O | Intel / Altera
EP2S130F1020I4N ✗ Tapus ng BuhayPagsanggunian na paghahambing
| Parametro | EP2S130F1020I4N | EP2S130F1020I4 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Tapus ng Buhay | Obsolete |
| Family | Stratix II | Stratix II |
| Logic Elements | 132,540 | 132,540 |
| Logic Array Blocks (LABs) | 6,627 | — |
| Total RAM Bits | 6,747,840 | — |
| User I/O Count | 742 | — |
| Core Voltage (VCCINT) | 1.15 V to 1.25 V | 1.2 V |
| Temperature na Operasyon | -40C to +100C (TJ, Industrial) | — |
| Packhaging / Kaso | 1020-BBGA (FineLine BGA, FC-FBGA) | — |
| Supplier Device Package | 1020-FBGA | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount (FC-FBGA) |
| Process Node | 90 nm | 90 nm CMOS, all-layer copper |
| Internal Operating Frequency | up to 711.24 MHz | — |
| Speed Grade | I4 (Industrial, speed bin 4) | I (industrial performance) |
| Configuration | SRAM-based, volatile configuration memory | — |
| Design Software | Quartus II (legacy) | — |
| Tindminan RoHS | [DATA_NEEDED: RoHS compliance status] | Compliant (per distributor listings) |
| Lead-Free | [DATA_NEEDED: lead-free / lead-bearing finish] | — |
| Equivalent LEs | — | ~180,000 |
| Adaptive Logic Modules (ALMs) | — | 53,016 |
| Embedded Memory (bits) | — | 6,747,840 |
| Embedded Memory (M512 blocks) | — | 530 |
| Embedded Memory (M4K blocks) | — | 768 |
| Embedded Memory (M-RAM blocks) | — | 4 |
| Embedded 18x18 Multipliers | — | 504 |
| DSP Blocks | — | 48 |
| User I/O Pins | — | 742 |
| User I/O Banks | — | 12 |
| Packhaging | — | 1020-ball FC-FBGA (33x33 mm) |
| Device Revision | — | 4 |
| Temperature ng Junction na Operasyon | — | -40C to +100C (industrial) |
| Configuration Scheme | — | Fast Passive Parallel x8, Passive Serial, JTAG |