EP2S130F1508C3 vs EP2S130F1508C5RB Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2S130F1508C3 sa pamamagitan ng Intel at EP2S130F1508C5RB sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP2S130F1508C3 | EP2S130F1508C5RB |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Huling Pagbili | NRND |
| Family | Stratix II | Stratix II |
| Logic Elements | 132,540 | 132,600 |
| Adaptive Logic Modules (ALMs) | [DATA_NEEDED: ALM count] | — |
| Embedded Memory (bits) | 6,747,840 | — |
| Maximum User I/O | 1,126 | — |
| Process Technology | 90 nm | 90 nm CMOS |
| Core Voltage (typical) | 1.2 V | — |
| Speed Grade | C3 (commercial) | 5 (C5, commercial) |
| Packhaging | 1508-ball FC-BGA | 1508-ball FBGA (F1508), 40x40 mm, 1.5 mm pitch |
| Temperature na Operasyon | 0C to +85C (commercial) | 0C to +85C (commercial, junction) |
| DSP Blocks | [DATA_NEEDED: DSP block count] | — |
| Transceivers | [DATA_NEEDED: transceiver count/grade] | — |
| PLLs (Fast + Enhanced) | 8 + 4 (per family) | — |
| Configuration Modes | Passive Serial, Fast Passive Parallel, JTAG | — |
| Tindminan RoHS | Compliant | Compliant |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount (FBGA) |
| Level ng MSL | [DATA_NEEDED: MSL level] | 3 (per JEDEC J-STD-020) |
| Logic Array Blocks (LABs) | — | 6,727 |
| User I/Os | — | 1,126 |
| Embedded Memory | — | 6,747 Kbits (TriMatrix: MRAM/M4K/M512) |
| Embedded 18x18 Multipliers | — | 252 (504 9x9 equivalent) |
| Core Voltage | — | 1.2 V (typical) |
| Lead-Free | — | Yes |
| Lifecycle | — | Not Recommended for New Designs (NRND) |