EP2S30F672C3 vs EP2S30F672C5 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2S30F672C3 sa pamamagitan ng Intel at EP2S30F672C5 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP2S30F672C3 | EP2S30F672C5 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Obsolete | Obsolete |
| Series | Stratix II | — |
| Number of Logic Elements | 33,880 | — |
| Number of Adaptive Logic Modules (ALMs) | 13,560 | — |
| Total Embedded Memory Bits | 1,369,728 | — |
| Embedded Memory (M512 / M4K / M-RAM blocks) | M512, M4K, M-RAM TriMatrix | — |
| Total RAM Bits | 1,369,728 | 1,369,728 |
| Number of User I/O | 500 | — |
| Number of Transceivers | [DATA_NEEDED: depends on variant - up to 12] | — |
| DSP Blocks | Dedicated 18x18 multipliers | — |
| DSP Performance | Up to 156 GMACs | — |
| Voltage - Supply | 1.2 V core, multi-rail I/O | — |
| Temperature na Operasyon | 0C to +85C (Commercial) | — |
| Speed Grade | -3 | C5 (moderate-speed bin) |
| Packhaging / Kaso | 672-BBGA, FCBGA (FineLine BGA) | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount (BGA) |
| Process Technology | 90 nm CMOS | 90 nm CMOS |
| Tindminan RoHS | Non-compliant (leaded BGA) | [DATA_NEEDED: confirmed RoHS compliance] |
| Level ng MSL | [DATA_NEEDED: MSL rating] | — |
| Family | — | Stratix II |
| Logic Elements | — | 33,880 |
| Logic Array Blocks (LABs) | — | 1,694 |
| Embedded Multipliers (DSP blocks) | — | 12 DSP blocks |
| Maximum User I/Os | — | 500 |
| Core Voltage | — | 1.2 V |
| Maximum Operating Frequency | — | 609.76 MHz |
| Packhaging | — | 672-pin FC-FBGA (flip-chip) |
| Operating Temperature (Commercial) | — | 0C to 85C junction |
| Uri ng Memory | — | TriMatrix (M512 / M4K / M-RAM) |