EP2S60F1020C4N vs EP2S60F1020I4 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2S60F1020C4N sa pamamagitan ng Intel at EP2S60F1020I4 sa pamamagitan ng Altera. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP2S60F1020C4N | EP2S60F1020I4 |
|---|---|---|
| Brand | Intel | Altera |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Obsolete | NRND |
| Series | Stratix II | Stratix II |
| Family | Stratix II (EP2S60) | — |
| Logic Elements | 60,440 | — |
| Adaptive Logic Modules (ALMs) | 30,220 (approx.) | — |
| Logic Array Blocks (LABs) | 3,022 | — |
| Embedded Memory (bits) | 2,544,192 | 2,544,192 |
| Embedded Memory Blocks | M512/M4K/M-RAM TriMatrix memory | — |
| DSP Blocks (18-bit x 18-bit) | Up to 48 (24 per DSP block column pair typical) | — |
| User I/Os | 718 | — |
| Maximum Core Frequency | 711.24 MHz (per Arrow listing) | — |
| Core Voltage | 1.2 V | — |
| Process Technology | 90 nm CMOS | 90 nm CMOS |
| Packhaging | 1020-ball FC-FBGA (Fine-pitch Chip-Scale BGA) | — |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount |
| Operating Temperature Grade | Commercial (C4 suffix indicates commercial, speed grade 4) | — |
| Configuration Modes | Passive Serial, Fast Passive Parallel, JTAG | — |
| PLLs / Clock Networks | Yes - on-chip PLLs and global clock networks | — |
| Tindminan RoHS | EU RoHS compliant with exemption (per Arrow listing) | Non-compliant (contains lead per legacy Altera package) |
| Manufacturer | — | Intel / Altera |
| Logic Elements (LEs) | — | 60,440 |
| Number of LABs/CLBs | — | 3022 |
| Number of CLBs | — | 24176 |
| Maximum User I/O | — | 718 |
| Number of I/O Banks | — | [DATA_NEEDED: number of I/O banks] |
| Operating Voltage (Core) | — | 1.2 V |
| Temperature Grade | — | Industrial (-40C to +100C TJ) |
| Package Type | — | 1020-ball FC-FBGA (Fine-pitch Chip-Scale BGA) |
| Package Dimensions | — | 33 mm x 33 mm |
| Ball Pitch | — | 1.0 mm |
| Configuration Method | — | Passive Serial / Fast Passive Parallel / JTAG |
| Number of PLLs | — | 12 |
| Global Clock Networks | — | 16 |
| Embedded Multipliers (18x18) | — | 36 |
| Transceiver Count | — | 0 (no embedded transceivers) |
| Maximum Embedded Memory Bandwidth | — | [DATA_NEEDED: memory bandwidth spec] |