EP2S60F1020C5N vs EP2S60F1020I4 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2S60F1020C5N sa pamamagitan ng Altera at EP2S60F1020I4 sa pamamagitan ng Altera. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP2S60F1020C5N | EP2S60F1020I4 |
|---|---|---|
| Brand | Altera | Altera |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | NRND |
| Series | Stratix II | Stratix II |
| Number of Logic Elements | 60440 | — |
| Number of LABs/CLBs | 3022 | 3022 |
| Number of Logic Array Blocks | 3022 LABs | — |
| Total RAM Bits | 2544192 bits | — |
| Number of User I/O | 718 | — |
| Packhaging / Kaso | 1020-BBGA, FCBGA | — |
| Number of Terminals | 1020 | — |
| Terminal Form | BALL | — |
| Package Code | BGA | — |
| Package Shape | SQUARE | — |
| Volte ng Pagbibigay | 1.15 V to 1.25 V | — |
| Temperature na Operasyon | 0°C ~ 85°C (TJ) | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Speed Grade / Order Code | C5 (commercial speed grade per Altera order code) | — |
| Tindminan RoHS | [DATA_NEEDED: RoHS status] | Non-compliant (contains lead per legacy Altera package) |
| Moisture Sensitivity Level | [DATA_NEEDED: MSL] | — |
| Number of DSP Blocks | [DATA_NEEDED: Number of DSP blocks] | — |
| Number of M512 RAM Blocks | [DATA_NEEDED: Number of M512 RAM blocks] | — |
| Number of M4K RAM Blocks | [DATA_NEEDED: Number of M4K RAM blocks] | — |
| Manufacturer | — | Intel / Altera |
| Logic Elements (LEs) | — | 60,440 |
| Embedded Memory (bits) | — | 2,544,192 |
| Number of CLBs | — | 24176 |
| Maximum User I/O | — | 718 |
| Number of I/O Banks | — | [DATA_NEEDED: number of I/O banks] |
| Operating Voltage (Core) | — | 1.2 V |
| Process Technology | — | 90 nm CMOS |
| Temperature Grade | — | Industrial (-40C to +100C TJ) |
| Package Type | — | 1020-ball FC-FBGA (Fine-pitch Chip-Scale BGA) |
| Package Dimensions | — | 33 mm x 33 mm |
| Ball Pitch | — | 1.0 mm |
| Configuration Method | — | Passive Serial / Fast Passive Parallel / JTAG |
| Number of PLLs | — | 12 |
| Global Clock Networks | — | 16 |
| Embedded Multipliers (18x18) | — | 36 |
| Transceiver Count | — | 0 (no embedded transceivers) |
| Maximum Embedded Memory Bandwidth | — | [DATA_NEEDED: memory bandwidth spec] |