EP2SGX130GF1508I4N vs EP2SGX130GF1508C3N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2SGX130GF1508I4N sa pamamagitan ng Intel at EP2SGX130GF1508C3N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP2SGX130GF1508I4N - Stratix II GX FPGA 132K LE 1508-FCBGA | Intel
EP2SGX130GF1508I4N ⚠ Huling PagbiliIntel
EP2SGX130GF1508C3N - Stratix II GX FPGA, 132K LEs, 20x Transceivers | Intel
EP2SGX130GF1508C3N ⚠ Huling PagbiliPagsanggunian na paghahambing
| Parametro | EP2SGX130GF1508I4N | EP2SGX130GF1508C3N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Huling Pagbili | Huling Pagbili |
| Series | Stratix II GX | Stratix II GX |
| Logic Elements (LE) | 132,540 | — |
| Adaptive Logic Modules (ALMs) | 6,627 | — |
| Embedded Memory Bits | 6,747,840 | — |
| User I/O Count | 734 | — |
| Number of LABs/CLBs | 6,627 | — |
| Core Voltage | 1.2 V | — |
| Process Technology | 90 nm CMOS | 90 nm CMOS |
| Operating Temperature Grade | Industrial (-40C to +100C) | — |
| Speed Grade | I4 (fast) | — |
| Packhaging | 1508-ball FCBGA (flip-chip BGA) | 1508-ball FBGA (FCBGA), 40 x 40 mm, 1.0 mm pitch |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Configuration Method | Passive Serial / Fast Passive Parallel / JTAG | — |
| Tindminan RoHS | Compliant | Lead-free / RoHS Compliant |
| Lead-Free | Yes | — |
| Number of Transceivers | [DATA_NEEDED: number of transceiver channels] | 20 |
| Maximum Transceiver Data Rate | [DATA_NEEDED: max Gbps per channel] | — |
| Number of PLLs | [DATA_NEEDED: PLL count] | 12 |
| DSP Blocks | [DATA_NEEDED: DSP block count] | — |
| MSL Moisture Sensitivity Level | [DATA_NEEDED: MSL rating] | — |
| Family | — | FPGA - Field Programmable Gate Array |
| Logic Elements | — | 132,540 |
| Logic Array Blocks (LABs) | — | 6,627 |
| User I/Os | — | 734 |
| Total RAM Bits | — | 6,747,840 (approximately 6.75 Mbit) |
| Transceiver Data Rate (max) | — | 6.375 Gbps |
| Number of 18x18 Multipliers | — | 56 |
| Internal Fabric Clock (max) | — | 717 MHz |
| Memory Clock (max) | — | 717 MHz |
| Core Supply Voltage | — | 1.15 V to 1.25 V |
| Operating Temperature Range (TJ) | — | 0 °C to 85 °C (commercial) |
| Estimated EOL Date | — | 2023 (per GlobalSpec listing) |